0.9mm [0.035"]
Top View
0.9mm
[0.035"]
0.8mm typ.
17mm
[0.669"]
15.2mm square [0.598"]
17mm [0.669"]
0.2mm dia.
[0.008"]
Side View
2
4.55mm
[0.179"]
1
3
0.36mm ± 0.05mm
[0.014" ± 0.002"]
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material;
Non-clad
1
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
2
3
Solder Balls: Sn63Pb37
Description: Giga-snaP BGA SMT Foot
256 position terminal pins (0.8mm centers, 20x20 array) to SMT solder balls (BGA type). Pin asignment 1:1.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
Scale: 6:1
Status: Released
Rev: B
SF-BGA256N-B-61 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
Drawing: A. Evans
Date: 5/28/09
Modified: 09/02/14
File: SF-BGA256N-B-61 Dwg.mcd
www.ironwoodelectronics.com
IRONWOOD [ IRONWOOD ELECTRONICS. ]