12.33mm [0.485"]
Ø 0.42mm pad (x71)
[Ø 0.017"]
0.80mm typ.
20.90mm 14.40mm
[0.823"] [0.567"]
1
0.80mm typ.
Top View
6.40mm
[0.252"]
4.55mm
[0.179"]
RoHS
2.96mm
[0.116"]
2
Side View
0.20mm
[0.008"]
Substrate: 1.59mm ±0.18mm [0.062" ±0.007"]
FR4/G10 or equivalent high temp material.
Non-clad.
1
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
Description: Land Socket
71 position BGA SMT pads to 71 position pins. Pin connection is 1:1.
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without
notice.
Scale: 4:1
Status: Released
Rev: C
LS-BGA71A-61 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
Drawing: J. Glab
Date: 10/19/06
Modified: 01/17/13, DH
File: LS-BGA71A-61 Dwg.mcd
www.ironwoodelectronics.com
IRONWOOD [ IRONWOOD ELECTRONICS. ]