23.00mm
[0.906"]
1.00mm
[0.039"]
Top View
1.00mm
[0.039"]
A
t
b
F
w
A
a
1.00mm typ.
23.00mm
[0.906"]
1
3.76mm
[0.148"]
Side View
1.68mm
[0.066"]
2
Ø 0.20mm [0.008"] ±0.0005"
21.00mm [0.827"]
Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
FR4/G10 or equivalent high temp material.
1
2
Pins: material- Brass Alloy 360 1/2 hard; finish-
0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.).
Description: Giga-snaP BGA SMT Land Socket
484 position BGA surface mount land pattern to terminal pins (1.0mm [0.039"] centers, 20x20 array)
Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position)
±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice.
Scale: 5:1
Status: Released
Rev: C
LS-BGA484C-41 Drawing
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: (651) 452-8100
Drawing: H. Hansen
File: LS-BGA484C-41 Dwg
Date: 7/27/04
Modified: 4/19/05
www.ironwoodelectronics.com
IRONWOOD [ IRONWOOD ELECTRONICS. ]