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IBMB6M32734HGA-8NT 参数 Datasheet PDF下载

IBMB6M32734HGA-8NT图片预览
型号: IBMB6M32734HGA-8NT
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM Module, 32MX72, 0.8ns, CMOS, DIMM-184]
分类和应用: 时钟动态存储器双倍数据速率内存集成电路
文件页数/大小: 23 页 / 421 K
品牌: IBM [ IBM ]
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IBMB6M32734HGA  
Preliminary  
Features  
32Mx72 One Bank Registered DDR SDRAM Module  
preamble and one-half clock post-amble  
• Differential clock inputs  
• Data is read or written on both clock edges  
• Address and control signals are fully synchro-  
nous to positive clock edge  
• 184-Pin Registered 8-Byte Dual In-Line Memory  
Module  
• 32Mx72 Double Data Rate (DDR) SDRAM  
DIMM (32M X 8 SDRAMS)  
• Programmable Operation:  
• Performance:  
- DIMM CAS Latency: 3, 3.5  
- Burst Type: Sequential or Interleave  
- Burst Length: 2, 4, 8  
PC1600  
Units  
DIMM CAS Latency  
Clock Frequency  
Clock Cycle  
3
3.5  
125  
8.0  
f
t
f
100  
10  
MHz  
ns  
CK  
CK  
DQ  
- Operation: Burst Read and Write  
• Auto Refresh (CBR) and Self Refresh Modes  
• Automatic and controlled precharge commands  
• Power Down Mode  
DQ Burst Frequency  
200  
250  
MHz  
• Intended for 100 MHz applications  
• Inputs and outputs are SSTL-2 compatible  
• V = 2.5Volt ± 0.2, V = 2.5Volt ± 0.2  
• 13/10/2 Addressing (row/column/bank)  
• 7.8 µs Max. Average Periodic Refresh Interval  
• Card size: 5.25" x 0.157" x 1.70"  
• Gold contacts  
• SDRAMS in 66-pin TSOP-II Package  
• Serial Presence Detect  
DD  
DDQ  
• Single Pulsed RAS interface  
• SDRAMs have four internal banks for concur-  
rent operation  
• Module has one physical bank  
• Bi-directional data strobe with one clock cycle  
Description  
IBMB6M32734HGA is a registered 184-Pin Double  
Data Rate (DDR) Synchronous DRAM Dual In-Line  
Memory Module (DIMM), organized as a one-bank  
high-speed memory array. The 32Mx72 module is a  
single-bank DIMM that uses nine 32Mx8 DDR  
SDRAMs in 400 mil TSOP packages. This DIMM  
achieves high-speed data transfer rates of up to 250  
MHz.  
be programmed into the DIMM by address inputs  
A0-A12 and I/O inputs BA0 and BA1 using the  
mode register set cycle. The DIMM CAS latency  
exceeds the SDRAM device specification by one  
clock due to the address and control signals being  
clocked to the SDRAM devices.  
These DIMMs are manufactured using raw cards  
developed for broad industry use by IBM as refer-  
ence designs. The use of these common design  
files will minimize electrical variation between sup-  
pliers.  
The DIMM is intended for use in applications oper-  
ating from 100 MHz to 125 MHz clock speeds with  
data rates of 200 to 250 MHz. All control and  
address signals are re-driven through registers to  
the DDR SDRAM devices. The control and address  
input signals are latched in the register on one rising  
clock edge and sent to the SDRAM devices on the  
following rising clock edge.  
The DIMM uses serial presence detects imple-  
mented via a serial EEPROM using the two-pin IIC  
protocol. The first 128 bytes of serial PD data are  
programmed and locked during module assembly.  
The last 128 bytes are available to the customer.  
A phase-locked loop (PLL) on the DIMM is used to  
re-drive the differential clock signals to both the  
DDR SDRAM devices and the registers, thus mini-  
mizing system clock loading. Clock enable (CKE0)  
controls all devices on the DIMM.  
All IBM 184 DDR SDRAM DIMMs provide a high-  
performance, flexible 8-byte interface in a 5.25” long  
space-saving footprint.  
Prior to any access operation, the device CAS  
latency and burst type/length/operation type must  
©IBM Corporation. All rights reserved.  
Use is further subject to the provisions at the end of this document.  
19L7358.H02502A  
1/01  
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