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IBM25PPC440GX-3CC533E 参数 Datasheet PDF下载

IBM25PPC440GX-3CC533E图片预览
型号: IBM25PPC440GX-3CC533E
PDF下载: 下载PDF文件 查看货源
内容描述: [RISC Microprocessor, 32-Bit, 533MHz, CMOS, CBGA552, 25 X 25 MM, CERAMIC, BGA-552]
分类和应用: 时钟外围集成电路
文件页数/大小: 76 页 / 1637 K
品牌: IBM [ IBM ]
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Preliminary  
PowerPC 440GX Embedded Processor Data Sheet  
Features  
®
• TCP/IP Acceleration Hardware (TAH) provided  
for 10/100/1000 Mbps ports that performs  
checksum processing, TCP segmentation, and  
includes support for jumbo frames  
• PowerPC 440 processor core operating up to  
800MHz with 32KB I- and D-caches (with parity  
checking)  
• On-chip 256KB SRAM configurable as L2 Code  
store or Ethernet Packet store memory  
• Two Ethernet 10/100Mbps half- or full-duplex  
interfaces. Operational modes supported are  
MII, RMII, and SMII.  
• Selectable processor:bus clock ratios (Refer to  
the Clocking chapter in the PPC440GX  
• Programmable Interrupt Controller supports  
interrupts from a variety of sources.  
Embedded Processor User’s Manual for details)  
• Double Data Rate (DDR) Synchronous DRAM  
(SDRAM) interface operating up to 166MHz  
• I2O Messaging unit for message transfer  
between the CPU and PCI-X  
• External Peripheral Bus (32 bits) for up to eight  
devices with external mastering  
• Programmable General Purpose Timers (GPT)  
• Two serial ports (16750 compatible UART)  
• Two IIC interfaces  
• DMA support for external peripherals, internal  
UART and memory  
• PCI-X V1.0a interface (32 or 64 bits, up to  
133MHz) with support for conventional PCI  
V2.3  
• General Purpose I/O (GPIO) interface available  
• JTAG interface for board level testing  
• Processor can boot from PCI memory  
• Available in ceramic and plastic packages  
• Two Ethernet 10/100/1000Mbps half- or full-  
duplex interfaces. Operational modes  
supported are SMII, GMII, RGMII, TBI and  
RTBI.  
Description  
Designed specifically to address high-end  
Technology: IBM CMOS Cu-11, 0.13µm , 6-layer  
metal  
embedded applications, the PowerPC 440GX  
(PPC440GX) provides a high-performance, low  
power solution that interfaces to a wide range of  
peripherals by incorporating on-chip power  
management features and lower power dissipation.  
Packages: 25mm, 552-ball Ceramic Ball Grid Array  
(CBGA) or Plastic Ball Grid Array (PBGA)  
Power (estimated): Less than:  
4W typical @533MHz  
This chip contains a high-performance RISC  
processor core, DDR SDRAM controller,  
configurable 256KB SRAM to be used as L2 cache  
or software-controlled on-chip memory, PCI-X bus  
interface, Gigabit Ethernet interfaces, TCP/IP  
acceleration hardware, I2O messaging unit, control  
for external ROM and peripherals, DMA with  
scatter-gather support, serial ports, IIC interface,  
and general purpose I/O.  
5W typical @667MHz  
6W typical @800MHz (estimated)  
Supply voltages required: 3.3V, 2.5V, 1.5V  
While the information contained herein is believed to be accurate, such information is preliminary, and should not be  
relied upon for accuracy or completeness, and no representations or warranties of accuracy or completeness are made.  
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6/30/04