IBM11M1730BB1M
x 72 E10/10, 3.3V, Au.
IBM11M4730H
IBM11M4730HB
4M x 72 DRAM MODULE
Features
• Au contacts
• 168 Pin JEDEC Standard, 8 Byte Dual In-line
Memory Module
• Optimized for ECC applications
• System Performance Benefits:
-Buffered inputs (except RAS, Data)
• 4Mx72 (Dual Bank) Fast Page Mode DIMM
• Performance:
-60
-70
-Reduced noise (32 V /V pins)
SS CC
tRAC
tCAC
tAA
RAS Access Time
60ns
20ns
35ns
70ns
25ns
40ns
-Buffered PDs
CAS Access Time
• Fast Page Mode, Read-Modify-Write Cycles
Access Time From Address
Cycle Time
• Refresh Modes: RAS-Only, CBR and Hidden
Refresh
tRC
110ns 130ns
40ns 45ns
tPC
Fast Page Mode Cycle Time
• 2048 refresh cycles distributed across 32ms
• 11/10 addressing (Row/Column)
• All inputs and outputs are LVTTL (3.3V) or TTL
(5.0V) compatible
• Single 3.3V ± 0.3V or 5.0V ± 0.5V Power Supply
• Card size: 5.25" x 1.5" x 0.157"
• DRAMS in TSOP Package
Description
IBM11M4730H is an industry standard 168-pin
8-byte Dual In-line Memory Module (DIMM) which is
organized as a 4Mx72 high speed memory array,
designed for ECC applications, and is configured as
2 2Mx72 banks. The DIMM uses 18 2Mx8 DRAMs in
TSOP packages.
bits provide information about the DIMM density,
addressing, performance and features. PD bits can
be dotted at the system level and activated for each
DIMM position using the PD enable (PDE) signal. ID
bits also allow detection of card features, and may
be dot-or’d at the system level to provide information
for the entire DIMM bank. For example, the system
will determine that ECC DIMMs are installed if PD8
is low (0). ID0 need not be sensed since both x72
and x80 ECC DIMMs will function in a x72 bank.
Improved system performance is provided by the
on-DIMM buffering of selected input signals. The
specified timings include all buffer, net and skew
delays, which simplifies the memory subsystem
design analysis. The data and RAS signals are not
buffered, which preserves the DRAM access specifi-
cations of 60ns and 70ns.
All IBM 168-pin DIMMs provide a high performance,
flexible 8-byte interface in a 5.25” long space-saving
footprint. Related products are the x64 and x72 par-
ity (5V) DIMMs and ECC DIMMs (5V and 3.3V).
Presence Detect (PD) and Identification Detect (ID)
Card Outline (3.3V)
Detail A
(Front)
(Back)
1
85
10 11
94 95
84
168
40 41
124 125
See Detail A
for 5.0V Version
©IBM Corporation. All rights reserved.
Use is further subject to the provisions at the end of this document.
54H8529
SA14-4637-01
Released 3/96
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