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EMP311 参数 Datasheet PDF下载

EMP311图片预览
型号: EMP311
PDF下载: 下载PDF文件 查看货源
内容描述: 21.0 - 24.0 GHz功率放大器MMIC [21.0 - 24.0 GHz Power Amplifier MMIC]
分类和应用: 放大器功率放大器
文件页数/大小: 2 页 / 144 K
品牌: EXCELICS [ EXCELICS SEMICONDUCTOR, INC. ]
 浏览型号EMP311的Datasheet PDF文件第1页  
EMP311  
PRELIMINARY DATA SHEET  
ASSEMBLY DRAWING  
21.0 – 24.0 GHz Power Amplifier MMIC  
The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line  
and separate the wires to minimize the mutual inductance.  
CHIP OUTLINE  
Chip size 1130 X 2250 microns  
Chip Thickness: 75±13 microns  
PAD Dimensions: 100 x 100 microns  
All Dimensions in Microns  
Specifications are subject to change without notice.  
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085  
Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com  
page 2 of 2  
Revised September 2004