Et r on Tech
EM567169BC
Operating Mode
CE1# CE2 OE# WE# LB# UB# DQ0~DQ7 DQ8~DQ15
Mode
Deselect
Power
X
L
H
H
H
H
H
H
H
H
H
H
X
X
X
H
H
L
X
X
X
H
H
H
H
H
L
X
X
H
L
X
X
H
X
L
High-Z
High-Z
High-Z
High-Z
High-Z
D-out
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
D-out
Deep Power Down
Standby
Standby
Active
H
Deselect
L
Deselect
L
Output Disabled
Output Disabled
Lower Byte Read
Upper Byte Read
Word Read
L
X
L
Active
L
H
L
Active
L
L
H
L
High-Z
D-out
Active
L
L
L
D-out
Active
L
L
X
X
X
L
H
L
D-in
High-Z
D-in
Lower Byte Write
Upper Byte Write
Word Write
Active
L
H
L
High-Z
D-in
Active
L
L
L
D-in
Active
Note:
X=don’t care. H=logic high. L=logic low.
Absolute Maximum Ratings1)
Supply voltage, VCC
-0.2 to +3.6V
Input voltages, VIN
-0.2 to VCC + 0.3V
-2.0 to +3.6V*
100 mA
Input and output voltages, VIN, VOUT
Output short circuit current ISH
Operating temperature, TA
Storage temperature, TSTRG
Soldering Temperature (10s), TSOLDER
Power dissipation, PD
-25 to +85°C
-65 to +125°C
240°C
1 W
Note:
Absolute maximum DC requirements contains stress ratings only. Functional operation at the absolute
maximum limits is not implied or guaranteed. Extended exposure to maximum ratings may affect device
reliability.
Recommended DC Operating Conditions
Symbol
VCC
Parameter
Power Supply Voltage
Ground
Min.
2.7
Typ.
3.0
−
Max.
3.3
Unit
V
VSS
0
0
V
VIH
Input High Voltage
Input Low Voltage
2.2
-0.22)
VCC+0.21)
V
−
VIL
+0.6
V
−
Notes:
1. Overshoot: VCC + 2.0V in case of pulse width ≤ 20ns
2. Undershoot: -2.0V in case of pulse width ≤ 20ns
3. Overshoot and undershoot are sampled, not 100% tested.
4
Rev 0.6
Apr. 2004