欢迎访问ic37.com |
会员登录 免费注册
发布采购

M24L416256SA-70TEG 参数 Datasheet PDF下载

M24L416256SA-70TEG图片预览
型号: M24L416256SA-70TEG
PDF下载: 下载PDF文件 查看货源
内容描述: 4兆位( 256K ×16 )伪静态RAM [4-Mbit (256K x 16) Pseudo Static RAM]
分类和应用:
文件页数/大小: 14 页 / 317 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
 浏览型号M24L416256SA-70TEG的Datasheet PDF文件第1页浏览型号M24L416256SA-70TEG的Datasheet PDF文件第2页浏览型号M24L416256SA-70TEG的Datasheet PDF文件第3页浏览型号M24L416256SA-70TEG的Datasheet PDF文件第4页浏览型号M24L416256SA-70TEG的Datasheet PDF文件第6页浏览型号M24L416256SA-70TEG的Datasheet PDF文件第7页浏览型号M24L416256SA-70TEG的Datasheet PDF文件第8页浏览型号M24L416256SA-70TEG的Datasheet PDF文件第9页  
ESMT  
M24L416256SA  
AC Test Loads and Waveforms  
Parameters  
3.0V VCC  
22000  
22000  
11000  
1.50  
Unit  
R1  
R2  
RTH  
VTH  
V
Switching Characteristics (Over the Operating Range)[10]  
–55  
–60  
–70  
Prameter  
Description  
Unit  
Min.  
55  
Max.  
Min.  
60  
Max.  
Min.  
70  
Max.  
Read Cycle  
tRC  
tAA  
tOHA  
Read Cycle Time  
Address to Data Valid  
Data Hold from Address Change  
ns  
ns  
ns  
55  
60  
70  
5
8
10  
tACE  
55  
25  
60  
25  
70  
35  
ns  
ns  
ns  
ns  
ns  
CE LOW to Data Valid  
OE LOW to Data Valid  
OE LOW to Low Z[11, 13]  
OE HIGH to High Z[11, 13]  
CE LOW to Low Z[11, 13]  
tDOE  
tLZOE  
tHZOE  
tLZCE  
5
2
5
2
5
5
25  
25  
25  
tHZCE  
tDBE  
25  
55  
25  
60  
25  
70  
ns  
ns  
ns  
CE HIGH to High Z[11, 13]  
BLE / BHE LOW to Data Valid  
tLZBE  
5
5
5
BLE /BHE LOW to Low Z[11, 13]  
tHZBE  
10  
0
10  
5
25  
10  
ns  
ns  
BLE /BHE HIGH to High-Z[11, 13]  
Address Skew  
[14]  
tSK  
Write Cycle[12]  
tWC  
Write Cycle Time  
55  
45  
60  
45  
70  
60  
ns  
ns  
tSCE  
CE LOW to Write End  
tAW  
tHA  
tSA  
Address Set-up to Write End  
Address Hold from Write End  
Address Set-up to Write Start  
45  
0
0
45  
0
0
55  
0
0
ns  
ns  
ns  
tPWE  
40  
40  
45  
ns  
WE Pulse Width  
Notes:  
10. Test conditions for all parameters other than tri-state parameters assume signal transition time of 1 ns/V, timing reference  
levels of VCC(typ)/2, input pulse levels of 0V to V CC(typ.), and output loading of the specified IOL/IOH as shown in the “AC Test  
Loads and Waveforms” section.  
11. tHZOE, tHZCE, tHZBE, and tHZWE transitions are measured when the outputs enter a high impedance state.  
12. The internal Write time of the memory is defined by the overlap of WE , CE = VIL, BHE and/or BLE = VIL. All signals  
must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input set-up  
and hold timing should be referenced to the edge of the signal that terminates the write.  
13. High-Z and Low-Z parameters are characterized and are not 100% tested.  
14. To achieve 55-ns performance, the read access should be CE controlled. In this case tACE is the critical parameter and tSK is  
satisfied when the addresses are stable prior to chip enable going active. For the 70-ns cycle, the addresses must be stable  
within 10 ns after the start of the read cycle.  
Elite Semiconductor Memory Technology Inc.  
Publication Date: Jul. 2008  
Revision: 1.4 5/14