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M13S2561616A-4BG2A 参数 Datasheet PDF下载

M13S2561616A-4BG2A图片预览
型号: M13S2561616A-4BG2A
PDF下载: 下载PDF文件 查看货源
内容描述: [DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, 8 X 13 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, BGA-60]
分类和应用: 动态存储器双倍数据速率内存集成电路
文件页数/大小: 49 页 / 1228 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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ESMT  
M13S2561616A (2A)  
IDD Parameters and Test Conditions  
Test Condition  
Symbol  
Note  
Operating Current (one bank Active - Precharge):  
t
RC = tRC (min); tCK = tCK (min); DQ, DM, and DQS inputs changing once per clock cycle;  
IDD0  
Address and control inputs changing once every two clock cycles; CS = high between valid commands.  
Operating Current (one bank Active - Read - Precharge):  
One bank open; BL = 4; tRC = tRC (min); tCK = tCK (min); IOUT = 0mA;  
IDD1  
IDD2P  
IDD2F  
2
Address and control inputs changing once per deselect cycle; CS = high between valid commands  
Precharge Power-down Standby Current:  
All banks idle; Power-down mode; tCK = tCK (min); CKE VIL(max); VIN = VREF for DQ, DQS and DM.  
Precharge Floating Standby Current:  
CS VIH(min); All banks idle; CKE VIH(min); tCK = tCK (min);  
Address and other control inputs changing once per clock cycle; VIN = VREF for DQ, DQS, and DM.  
Precharge Quiet Standby Current:  
IDD2Q  
IDD3P  
CS VIH(min); All banks idle; CKE VIH(min); tCK = tCK (min);  
Address and other control inputs stable at VIH(min) or VIL(max); VIN = VREF for DQ, DQS, and DM.  
Active Power-down Standby Current:  
One bank active; Power-down mode; CKE VIL(max); tCK = tCK (min); VIN = VREF for DQ, DQS, and DM.  
Active Standby Current:  
CS VIH(min); CKE VIH(min); One bank active; tRC = tRAS (max); tCK = tCK (min);  
DQ, DM, and DQS inputs changing twice per clock cycle;  
Address and other control inputs changing once per clock cycle.  
IDD3N  
IDD4R  
IDD4W  
Operating Current (burst read):  
BL = 2; Continuous burst reads; One bank active;  
Address and control inputs changing once per clock cycle; tCK = tCK (min); IOUT = 0mA;  
50% of data changing on every transfer.  
Operating Current (burst write):  
BL = 2; Continuous burst writes; One bank active;  
Address and control inputs changing once per clock cycle; tCK = tCK (min);  
DQ, DM, and DQS inputs changing twice per clock cycle; 50% of input data changing at every transfer.  
Auto Refresh Current:  
IDD5  
IDD6  
t
RC = tRFC(min)  
Self Refresh Current:  
1
2
CKE 0.2V; external clock on; tCK = tCK (min)  
Operating Current (Four bank operation):  
IDD7  
Four-bank interleaving READs (burst = 4) with auto precharge; tRC = tRC (min); tCK = tCK (min);  
Address and control inputs change only during ACTIVE, READ, or WRITE commands; IOUT = 0mA.  
Notes:  
1. Enable on-chip refresh and address counters.  
2. Random address is changing; 50% of data is changing at every transfer.  
Elite Semiconductor Memory Technology Inc.  
Publication Date : Sep. 2012  
Revision : 1.4 6/49