ESMT
Preliminary
AD5165A
Pin Assignments
DFN 8L, 3x3mm
PWMB
8
1
2
SD#
AVDD
7 PGND
6
5
INP
INN
3
4
PVDD
9:Thermal Pad
PWMA
Pin Description
Pin
1
NAME
SD#
TYP DESCRIPTION
I
Shutdown AD5165A (Low active logic)
Power Supply
2
AVDD
P
I
3
INP
Positive differential input
Negative differential input
Positive output
4
INN
I
5
PWMA
PVDD
PGND
PWMB
Thermal Pad
O
P
G
O
G
6
High current power supply
High current ground
7
8
Negative output
9
Must be soldered to PCB’s ground plane
Available Package
θJA (oC/W)
Package Type
DFN 8L (3x3)
Device no.
AD5165A
Exposed Thermal Pad
Yes
45.8
Note1: The thermal pad is at the bottom of package. To optimize the performance of thermal
dissipation, solder the thermal pad to PCB’s ground plane is suggested.
Elite Semiconductor Memory Technology Inc.
Publication Date: Sep. 2007
Revision: 0.1 2/12
ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
