Ericsson Internal
E
EWEIXIE
PRODUCT SPECIFICATION
2 (4)
Prepared (also subject responsible if other)
No.
1/1301- BMR 655 Uen
2
Technical Specification
Approved
Checked
Date
Rev
EN/LZT 146 3R7e7feRre3nGce
Oct 2008
PKB4000C PI
SEC/D (Julia You)
MICMROS
2008-5-23
C
© Ericsson Power Modules AB
DC/DC converters, Input 36-75 V, Output 60A/144W
General Information
Compatibility with RoHS requirements
Ordering Information
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in
homogeneous materials for lead, mercury, hexavalent
chromium, PBB and PBDE and of 0.01% by weight in
homogeneous materials for cadmium.
See Contents for individual product ordering numbers.
Option
Surface mount
Suffix
SI
Ordering No.
PKB 4110C SI
Positive Remote Control Logic
Latching OCP
Latching OTP
P
LI
LT
PKB 4110C PIP
PKB 4110C PILI
PKB 4110C PILT
PKB 4110C PILV
PKB 4110C PILP
PKB 4110C PILIT
PKB 4110C PILIV
PKB 4110C PILPA
PKB 4110C PIM
PKB 4110C PILA
PKB 4110C PILB
PKB 4110C PIHS
Latching OVP
LV
LP
LIT
LIV
LPA
M
LA
LB
HS
Exemptions in the RoHS directive utilized in Ericsson
Power Modules products include:
Latching OTP and OVP
Latching OCP and OTP
Latching OCP and OVP
All protection features latching
Increased Stand-off height
Lead length 3.69 mm (0.145 in)
Lead length 4.57 mm (0.180 In)
Baseplate
-
Lead in high melting temperature type solder (used to
solder the die in semiconductor packages)
Lead in glass of electronics components and in
electronic ceramic parts (e.g. fill material in chip
resistors)
-
Note: As an example a positive logic, short pin, lathing OVP, baseplate
product would be PKB 4110C PIPLVHSLA.
-
Lead as an alloying element in copper alloy containing
up to 4% lead by weight (used in connection pins
made of Brass)
Reliability
The Mean Time Between Failure (MTBF) is calculated at full
output power and an operating ambient temperature (TA) of
+40°C, which is a typical condition in Information and
Communication Technology (ICT) equipment. Different
methods could be used to calculate the predicted MTBF
and failure rate which may give different results. Ericsson
Power Modules currently uses Telcordia SR332.
Quality Statement
The products are designed and manufactured in an
industrial environment where quality systems and methods
like ISO 9000, 6σ (sigma), and SPC are intensively in use to
boost the continuous improvements strategy. Infant
mortality or early failures in the products are screened out
and they are subjected to an ATE-based final test.
Conservative design rules, design reviews and product
qualifications, plus the high competence of an engaged
work force, contribute to the high quality of our products.
Predicted MTBF for the series is:
-
1 million hours according to Telcordia SR332, issue 1,
Black box technique.
Telcordia SR332 is a commonly used standard method
intended for reliability calculations in ICT equipment. The
parts count procedure used in this method was originally
modelled on the methods from MIL-HDBK-217F, Reliability
Predictions of Electronic Equipment. It assumes that no
reliability data is available on the actual units and devices
for which the predictions are to be made, i.e. all predictions
are based on generic reliability parameters.
Warranty
Warranty period and conditions are defined in Ericsson
Power Modules General Terms and Conditions of Sale.
Limitation of Liability
Ericsson Power Modules does not make any other
warranties, expressed or implied including any warranty of
merchantability or fitness for a particular purpose
(including, but not limited to, use in life support
applications, where malfunctions of product can cause
injury to a person’s health or life).
ERICSSON [ ERICSSON ]
