Technical Data
ASB1200V1/ASB1200VR in SMD package
T5300 in CSMP® technology
Characteristics
Pressure measurement
Absolute
Absolute
Absolute
Measurement media
Output signal
Inert moist gases
0 … 1 V
Inert moist gases
Ratiometric
Inert gases
Serial bus
Back side
T5300
Pressure from
Front side
Front side
Construction / type
ASB1200V1
ASB1200VR
Dimensions
Chip size / footprint
Total height (max.)
Flange diameter
mm 4 x 4
4 x 4
2.5
2.2 x 2.6
mm 2.5
mm 3.5
0.9
–
3.5
Maximum ratings
Measuring range
mbar (hPa) 300 ... 1200
°C -40 ... +125
300 ... 1200
-40 ... +125
-40 ... +85
2.7 … 5.5
300 ... 1200
-40 ... +125
-40 ... +85
2.7 ... 5.5
Storage temperature Tst
Operating temperature Ta
Supply voltage (max.) VDD
°C -40 …+85
V
2.7 … 5.5
Output
Pressure resolution
Temperature resolution
Interfaces
11 DAC
11 DAC
14 bit
bit
–
–
11
Analog 0 ... 1 V
10 … 90% ratiometric
260; 10 s
I2C, SPI
260; 10 s
Upon request
Soldering temperature
Ordering code
°C 260; 10 s
Upon request
Upon request
Important information: Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our
knowledge of typical requirements that are often placed on our products. We expressly point out that these statements cannot be regarded as binding statements about the suit-
ability of our products for a particular customer application. It is incumbent on the customer to check and decide whether a product is suitable for use in a particular application.
This publication is only a brief product survey which may be changed from time to time. Our products are described in detail in our data sheets. The Important Notes
(www.epcos.com/ImportantNotes) and the product-specific warnings and cautions must be observed. All relevant information is available through our sales offices.
© E P C O S A G 2 0 0 9 · C o r p o r a t e C e n t e r · E d i t i o n 0 5 / 2 0 0 9
O rd e r i n g N o . E P C : 6 9 0 0 2 - 7 6 0 0 · P r i n t e d i n G e r m a n y · P B 0 5 0 9 1 .
EPCOS [ EPCOS ]
