EM65101
128COM/160SEG 16 Gray Scale Level LCD Driver
4.2 Pin Dimensions
Bump Size
Item
Pad No.
Unit
X
Y
Chip size
-
10850
88
1380
38
1 ~ 3 ; 144 ~ 146
4 ~ 51 ; 99 ~ 143
52 ~ 98
35
78
Bump Size
Pad Pitch
50
61
147 ~ 169 ; 418 ~ 440
170 ~ 417
96
28
28
96
1 ~ 3 ; 144 ~ 146
4 ~ 51 ; 99 ~ 143
52 ~ 98
103
50
65
43
43
43
µm
147 ~ 169 ; 418 ~ 440
170 ~ 417
Min pitch
Die thickness
(excluding bumps)
20 ± 1 mil (500 ± 25 um)
Bump Height
17 ± 3 um
15 um
Minimum Bump Gap
Coordinate Origin
Chip center
4.3 Recommended COG ITO Traces Resistor
Interface
ITO Traces Resistances
V0~V4
CAP1+, CAP1-, CAP2+, CAP2-,CAP3+,CAP3-
CAP4+, CAP5+, VOUT, V2X
VDD, VEE, VSS
Max=50Ω
WRB,RDB,CSB,…, D0~D7
RESB
Max=3KΩ
Max=5~10KΩ
Product Specification (V0.4) 08.15.2005
• 3
(This specification is subject to change without further notice)
ELAN [ ELAN MICROELECTRONICS CORP ]
