EM57P300SERIES
TINYCONTROLLER-BASED
SOUNDPROCESSOR
EASYSOUND-
PAD DIAGRAM
P1.0
15
GND
16
P3.2 P3.3
VDD
1
VPP OSC
VO
2
18
17
3
4
(0,0)
EM57P300
P3.1
5
14
13
P1.1
7
8
9
10
11
12
P2.1
P1.3 P1.2
P3.0
P2.0
P2.3 P2.2
Chip Size : 3000 x 2100 um
For PCB layout, IC substrate must be connected to Vss.
Pad No.
Symbol
VDD
VO
X
Y
1
2
-158.4
-695.9
-1077.0
-1278.3
-1310.0
824.1
849.0
849.0
849.0
-741.5
3
P3.3
P3.2
P3.1
NC
4
5
6
7
P3.0
P2.3
P2.2
P2.1
P2.0
P1.3
P1.2
P1.1
P1.0
GND
OSC
VPP
-1128.5
-951.3
-780.0
752.2
-850.0
-850.0
-850.0
-850.0
-850.0
-850.0
-850.0
-721.5
849.0
824.1
849.0
849.0
8
9
10
11
12
13
14
15
16
17
18
923.5
1107.7
1284.0
1284.0
1246.7
1014.6
342.9
182.7
* This specification are subject to be changed without notice.
10.15.2001
8
ELAN [ ELAN MICROELECTRONICS CORP ]
