EBJ20RE4BAFA
Hex
Byte No. Function described
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 value Comments
21
SDRAM upper nibbles for tRAS and tRC
0
0
0
1
0
0
0
0
0
1
1
0
1
0
0
0
0
0
1
1
0
0
1
1
0
0
0
0
1
0
0
0
11H
SDRAM minimum active to precharge time
(tRAS), LSB
-DJ
22
20H
36ns
-AE, -8C
2CH 37.5ns
8CH 49.5ns
SDRAM minimum active to active /auto-
refresh time (tRC), LSB
-DJ
23
-AE
-8C
1
1
0
0
0
1
1
0
0
0
1
1
0
0
1
0
95H
50.625ns
A4H 52.5ns
SDRAM minimum refresh recovery time
delay (tRFC), LSB
24
25
26
27
28
0
0
0
0
1
0
0
0
1
1
0
1
1
0
0
1
1
0
0
1
1
0
1
0
0
0
1
0
0
70H
03H
110ns
110ns
SDRAM minimum refresh recovery time
delay (tRFC), MSB
0
SDRAM minimum internal write to read
command delay (tWTR)
1
1
3CH 7.5ns
3CH 7.5ns
SDRAM minimum internal read to
precharge command delay (tRTP)
Upper nibble for tFAW
-DJ
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
00H
01H
30ns
-AE, -8C
0
1
37.5ns
Minimum four activate window delay time
(tFAW)
-DJ
29
1
1
1
0
0
0
0
F0H
30ns
-AE
0
0
1
0
1
0
1
0
0
0
0
0
1
0
0
1
0
0
0
0
1
0
0
1
2Ch
40H
83H
37.5ns
-8C
40ns
30
31
SDRAM output drivers supported
DLL-off, RZQ/6, 7
PASR/2X refresh rate
at +85°C to +95°C
SDRAM refresh options
1
0
0
0
0
0
0
1
81H
32
33
Module thermal sensor
SDRAM device type
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
0
0
0
0
0
1
0
1
0
80H
00H
00H
10H
11H
02H
05H
00H
Incorporated
Standard
34 to 59 Reserved
—
60
61
62
63
64
Module nominal height
0
30 < height ≤ 31mm
Module maximum thickness
Reference Raw Card Used
DIMM module attributes
Heat Spreader Solution
0
0
0
0
Raw Card C
1row/1register
Not incorporated
Register vender ID (LSB)
(Inphi)
65
66
67
1
1
1
1
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
1
1
0
1
0
0
0
0
0
1
1
0
0
1
0
1
0
0
1
1
1
0
0
0
1
1
1
1
04H
80H
Naming bank=5
Naming bank=1
(TI)
Register vender ID (MSB)
(Inphi)
B3H Actual ID
97H
(TI)
Register revision
(Inphi)
03H
Rev.4
(TI)
1DH Rev. 3.1
Preliminary Data Sheet E1253E30 (Ver. 3.0)
7