EBJ11UE6BAU0
Hex
Byte No. Function described
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 value Comments
21
SDRAM upper nibbles for tRAS and tRC
0
0
0
1
0
0
0
0
0
1
1
0
1
0
0
0
0
0
1
1
0
0
1
1
0
0
0
0
1
0
0
0
11H
SDRAM minimum active to precharge time
(tRAS), LSB
-DJ
22
20H
36ns
-AE, -8C
2CH 37.5ns
8CH 49.5ns
SDRAM minimum active to active /auto-
refresh time (tRC), LSB
-DJ
23
-AE
-8C
1
1
0
0
0
1
1
0
0
0
1
1
0
0
1
0
95H
50.625ns
A4H 52.5ns
SDRAM minimum refresh recovery time
delay (tRFC), LSB
24
25
26
0
0
0
1
0
0
1
1
0
1
0
0
1
0
0
1
0
1
0
0
1
0
70H
03H
110ns
110ns
SDRAM minimum refresh recovery time
delay (tRFC), MSB
0
SDRAM minimum internal write to read
command delay (tWTR)
1
1
3CH 7.5ns
SDRAM minimum internal read to
precharge command delay (tRTP)
27
28
0
0
0
0
1
0
1
0
1
0
0
0
0
1
3CH 7.5ns
01H
Upper nibble for tFAW
0
Minimum four activate window delay time
29
(tFAW)
-DJ
0
1
1
0
1
0
0
0
68H
45ns
-AE, -8C
1
1
0
0
0
0
1
0
0
0
0
0
0
1
0
1
90H
83H
50ns
30
31
SDRAM output drivers supported
DLL-off / RZQ/6, 7
PASR / 2X refresh
rate at +85°C to
+95°C
SDRAM refresh options
1
0
0
0
0
0
0
1
81H
32
33
Module thermal sensor
SDRAM device type
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
1
0
0
0
0
0
1
0
0
0
0
0
1
0
0
0
0
0
1
1
0
00H
00H
00H
0FH
11H
00H
Not Incorparated
Standard
34 to 59 Reserved
—
60
61
62
Module nominal height
29 < height ≤ 30mm
Module maximum thickness
Reference raw card used
Raw Card A
Standard
Address mapping from edge connecter to
DRAM
63
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
0
1
1
0
0
0
0
00H
00H
02H
64 to
116
Module specific section
—
Module ID: manufacturer’s JEDEC ID
code, LSB
117
118
Elpida Memory
Module ID: manufacturer’s JEDEC ID
code, MSB
FEH Elpida Memory
119
120
121
Module ID: manufacturing location
Module ID: manufacturing date
Module ID: manufacturing date
×
×
×
×
×
×
×
×
×
×
×
×
×
×
×
×
×
×
×
×
×
×
×
×
××
××
××
Year code (BCD)
Week code (BCD)
122 to
125
Module ID: module serial number
×
×
×
×
×
×
×
×
××
Data Sheet E1243E40 (Ver. 4.0)
7