LHC RHC
HIGH VOLTAGE DIFFUSED SILICON RECTIFIERS
SMALL SIZE MOLDED PACKAGE
PRV 8,000 TO 40,000 VOLTS
FAST RECOVERY (RHC SERIES)
LOW LEAKAGE
EDI Type No.
Peak
Max . Fwd. Volta ge
Avg.
o
Reve rse Volta ge
PRV (Volts )
Drop at 25 C And IO
Fwd. Current,
Case Sty le
O
VF (Vol ts)
IO at 50 C
25mA
30
30
30
LHC25-8
-10
8,000
10,0 00
12,0 00
15,0 00
20,0 00
25,000
30,0 00
35,0 00
40,0 00
A
A
A
B
B
B
C
C
C
-12
-15
60
60
-20
-25
60
90
90
90
-30
-35
-40
RHC25-8
-10
8,000
10,0 00
12,0 00
15,0 00
20,0 00
25,0 00
30,0 00
35,0 00
40,0 00
A
A
A
B
B
B
C
C
C
30
30
30
-12
-15
60
60
-20
-25
60
90
90
90
-30
-35
-40
RHC SERIES
FAST
LHC SERIES
STANDARD
ELECTRICAL CHARACTERISTICS
ELECTRICAL CHARACTERISTICS
(at T
A
=25 C Unless Otherwise Specified)
(at TA
=25 C Unless Otherwise Specified)
RECOVERY
RECOVERY
o
o
Max. DC Reverse Current @ PRV and 25 C, I
A
1
C, I
A
1
Max. DC Reverse Current @ PRV and 25
Max. DC Reverse Current@ PRV and100
Max. Reverse Recovery Time , t rr (Fig.4)
R
R
o
o
C, I
A
C, I
Max. DC Reverse Current@ PRV and100
A
R
60
R
40
o
o
to +150
C
Ambient Operating Temperature Range,T
A
100 nanosec
-55
C
o
o
to +150
C
o
o
to +125
C
-55
Ambient Operating Temperature Range,TA
Storage TemperatureRange, T
STG
C
-55
-55
C
o
o
to +150
C
Max.One-Half Cycle Surge Current,
IFM
Storage Temperature Range, T
STG
C
Amps
3
(Surge )@ 60Hz
Max.One-HalfCycle Surge Current,
IFM
Amps
3
(Surge )@ 60Hz
NOTES:
o
1. Maximum lead and terminal temperature for soldering, 3/8 inch from case, 5 seconds at 250 C.
2. If operated over 10,000 v/inch in length, devices should be immersed in oil or re-encapsulated.
EDI reserves the right to change these specifications at any time without notice.
EDI [ ELECTRONIC DEVICES INC. ]
