DY PY
Figure 1
CURRENT DERATING
12
10
BRIDGE OUTPUT
RES IND LOADS
8
6
4
CAPACITIVE
LOADS
5
I
(PK)
(AV)
10
20
=
{
I
2
NOTE: I(PK) / I (AV ) ratio
refers to a single diode (leg)
0
40 50 60 70 80
90 100 110 120 130 140 150 160 170 180
O
TC CASE TEMPERATURE ( C)
Figure 3
Figure 2
NON-REPETITIVE SURGE CURRENT
POWER DISSIPATION
400
24
300
20
200
150
16
100
70
50
12
8
4
0
30
20
BRIDGE OUTPUT
RES IND LOADS
1
2
3
4
6
8
10
20
30 40
60 80 100
10
0
2
4
6
8
12
NUMBER OF CYCLES(60 Hz)
IF(AV). AVERAGE FORWARD CURRENT (AMP)
_
+
.040 .002 DIA.
MECH. OUTLINE
Dielectric test voltage 1500 volts rms, max. 50-60Hz.
.150DIA
THRU.
AC
+
1 MIN.
_
+
.463 .015
+
AC
_
.30 MAX.
_
+
.463 .015
.85MAX.
EPOXY
METAL
BASE
NOTES: 1. A thin film of silicone thermal compound is recommended between the Minibridge
case and mounting surface for improved thermal conduction.
2. Fast-onterminals available. Consult factory.
ELECTRONIC DEVICES, INC. DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951.
21 GRAY OAKS AVENUE
*
YONKERS. NEW YORK 10710 914-965-4400
* FAX 914-965-5531 * 1-800-678-0828
Ee-mail:sales@edidiodes.com
* Wwebsite: www.e-edi.com
EDI [ ELECTRONIC DEVICES INC. ]
