Spec. No. : C211SP
Issued Date : 2017.11.08
Revised Date :
CYStech Electronics Corp.
Page No. : 7/7
TO-277 Dimension
Marking:
Cathode
DISN
0165
Date
Code
□□
Anode
Cathode
TO-277 Plastic Surface
Mounted Package
CYStek Package Code: SP
Millimeters
DIM
Inches
Min.
Millimeters
Inches
Min.
DIM
Min.
1.05
0.80
1.70
0.15
0.20
4.00
3.90
Max.
Max.
0.045
0.039
0.074
0.014
0.013
0.169
0.159
Min.
Max.
3.15
6.60
5.45
3.65
4.60
Max.
0.124
0.260
0.215
0.144
0.181
A
b1
b2
b3
C
1.15
0.99
1.88
0.35
0.33
4.30
4.05
0.041
0.031
0.067
0.006
0.008
0.157
0.154
D2
E
E1
E2
E3
e
2.95
6.40
5.30
3.45
4.20
0.116
0.252
0.209
0.136
0.165
D
D1
1.84 TYP
0.072 TYP
L
0.75
0.95
0.030
0.037
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
Lead : Pure tin plated.
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
DISN0165SP
Preliminary
CYStek Product Specification