Spec. No. : C338S2
Issued Date : 2009.04.03
Revised Date : 2013.09.11
Page No. : 5/6
CYStech Electronics Corp.
Recommended wave soldering condition
Product
Peak Temperature
Soldering Time
5 +1/-1 seconds
Pb-free devices
260 +0/-5 °C
Recommended temperature profile for IR reflow
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Sn-Pb eutectic Assembly
Pb-free Assembly
3°C/second max.
3°C/second max.
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
Time maintained above:
−Temperature (TL)
− Time (tL)
183°C
60-150 seconds
240 +0/-5 °C
217°C
60-150 seconds
260 +0/-5 °C
Peak Temperature(TP)
Time within 5°C of actual peak
temperature(tp)
10-30 seconds
6°C/second max.
6 minutes max.
20-40 seconds
6°C/second max.
8 minutes max.
Ramp down rate
Time 25 °C to peak
temperature
Note : All temperatures refer to topside of the package, measured on the package body surface.
CSOD5817-5819S2
CYStek Product Specification