Spec. No. : C327SF
Issued Date : 2003.05.16
Revised Date :
CYStech Electronics Corp.
Page No. : 3/3
SOD-123 Dimension
Marking Code:
A
Device 4001 4002
4003
A3
4004
A4
Code
A1
A2
B
Device 4005 4006
Code A5 A6
4007
A7
D
SOD-123 Plastic Surface
Mounted Package
E
CYStek Package Code: SF
G
F
*:Typical
Inches
DIM
Millimeters
Inches
Millimeters
DIM
Min.
0.146
0.055
Max.
0.161
0.071
Min.
3.7
Max.
4.1
Min.
0.055
Max.
Min.
1.4
Max.
1.6
A
B
C
D
E
F
G
-
0.063
1.4
1.8
0.035(typ)
0.9(typ)
0.9(typ)
0.012(typ)
0.3(typ)
0.035(typ)
0.094
0.110
2.4
2.8
-
-
-
-
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CSOD400XSF
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
