Spec. No. : C062SH
Issued Date : 2016.07.01
Revised Date :
CYStech Electronics Corp.
Page No. : 5/6
Recommended wave soldering condition
Product
Peak Temperature
Soldering Time
5 +1/-1 seconds
Pb-free devices
260 +0/-5 C
Recommended temperature profile for IR reflow
Pb-free Assembly
Profile feature
Average ramp-up rate
(Tsmax to Tp)
Sn-Pb eutectic Assembly
3C/second max.
3C/second max.
Preheat
−Temperature Min(TS min)
−Temperature Max(TS max)
−Time(ts min to ts max)
100C
150C
60-120 seconds
150C
200C
60-180 seconds
Time maintained above:
−Temperature (TL)
− Time (tL)
183C
60-150 seconds
217C
60-150 seconds
Peak Temperature(TP)
240 +0/-5 C
260 +0/-5 C
Time within 5C of actual peak
temperature(tp)
10-30 seconds
6C/second max.
6 minutes max.
20-40 seconds
6C/second max.
8 minutes max.
Ramp down rate
Time 25 C to peak
temperature
Note : All temperatures refer to topside of the package, measured on the package body surface.
CSOD140BSH
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
