Spec. No. : C338AS
Issued Date : 2004.03.10
Revised Date :
CYStech Electronics Corp.
Page No. : 3/3
SMA-1 Dimension
Marking :
Device CSMA CSMA CSMA CSMA
SS12 SS13 SS14 SS15
Code SS12 SS13 SS14 SS15
B
A
Device CSMA CSMA CSMA
SS16 SS18 SS1B
C
G
Code SS16 SS18 SS1B
D
H
2-Lead SMA-1 Plastic
E
F
Surface Mounted Package
CYStek Package Code: AS
*:Typical
Inches
DIM
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
1.40
2.50
4.00
2.00
Max.
1.60
2.90
4.60
2.44
Min.
Max.
0.060
0.008
0.208
0.012
Min.
0.76
Max.
1.52
A
B
C
D
0.055
0.098
0.157
0.078
0.062
E
F
0.030
0.002
0.188
0.006
0.114
0.181
0.096
0.051
4.80
0.203
5.28
G
H
0.152
0.305
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CSMASS1XAS
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
