Spec. No. : C339SF
Issued Date : 2003.06.16
Revised Date :2007.08.24
Page No. : 3/3
CYStech Electronics Corp.
SOD-123 Dimension
Marking Code:
Device CSFR CSFR CSFR CSFR
101
102
103
104
Code
H1
H2
H3
H4
Device CSFR CSFR CSFR
105
106
107
Code
H5
H6
H7
SOD-123 Plastic Surface
Mounted Package
CYStek Package Code: SF
*:Typical
Inches
DIM
Millimeters
Inches
Millimeters
DIM
Min.
0.138
0.055
Max.
0.154
0.071
Min.
3.5
1.4
Max.
3.9
1.8
Min.
0.051
Max.
0.067
Min.
1.3
Max.
1.7
A
B
C
D
E
F
G
-
0.035(typ)
0.035(typ)
0.9(typ)
0.9(typ)
0.012(typ)
0.3(typ)
0.110
0.126
2.8
3.2
-
-
-
-
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CSFR10XSF
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
