Spec. No. : C326LC
Issued Date : 2003.05.20
Revised Date :
CYStech Electronics Corp.
Page No. : 3/3
DO-35(Glass) Dimension
E
A
A
B
C
D
B
C
D
DO-35 glass package, CYStek package code: LC
*:Typical
Inches
Min. Max.
Millimeters
Inches
Min. Max.
0.9646 1.2811
Millimeters
DIM
DIM
Min.
Max.
φ0.56
32.54
4.20
Min.
Max.
32.54
φ2.00
A
B
C
D
E
24.50
φ0.0181 φ0.0220 φ0.46
0.9646 1.2811
0.1200 0.1700
Notes : 1.Controlling dimension : millimeters.
24.50
3.05
φ0.0602 φ0.0787 φ1.53
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CBZX55CXXLC series
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
