Spec. No. : C660R3
Issued Date : 2016.11.02
Revised Date :
CYStech Electronics Corp.
Page No. : 5/5
TO-3P Dimension
Marking:
4
BU941Z
□□
Date Code
1
2
3
3-Lead TO-3P Plastic Package
CYStek Package Code: R3
Style: Pin 1.Base 2.Collector 3.Emitter
Millimeters
Inches
Min.
Millimeters
Min. Max.
13.450 REF
Inches
Min. Max.
0.530 REF
DIM
DIM
Min.
Max.
5.000
1.600
1.200
3.200
2.200
0.700
1.650
Max.
0.197
0.063
0.047
0.126
0.087
0.028
0.065
0.622
0.555
A
A1
b
b1
b2
c
c1
D
E
4.600
1.200
0.800
2.800
1.800
0.500
1.450
0.181
0.047
0.031
0.110
0.071
0.020
0.057
0.606
0.539
E3
F1
F2
L
L1
L2
Φ
G
e
H
h
13.400 13.800
0.528
0.543
0.386
1.587
0.929
0.811
0.280
0.219
9.400
9.800
0.370
1.571
0.913
0.799
0.272
0.203
39.900 40.300
23.200 23.600
20.300 20.600
6.900
5.150
7.100
5.550
15.450 15.850
13.700 14.100
3.200 REF
5.450 TYP
5.000 REF
0.000 0.300
0.215 TYP
0.197 REF
0.000 0.012
E1
E2
0.126 REF
0.130 REF
3.300 REF
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BU941ZR3
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
