Spec. No. : C619N3
Issued Date : 2012.08.21
Revised Date :
CYStech Electronics Corp.
Page No. : 2/7
Thermal Characteristics
Parameter
Symbol
Rth,j-a
Limit
Unit
Thermal Resistance, Junction-to-Ambient, in free air (Note)
Thermal Resistance, Junction-to-Solder point
417
70
°C/W
Rth,j-sp
Note : Device mounted on a FR-4 PCB, single sided copper, tin plated and standard footprint.
Characteristics
(Ta=25°C)
Symbol
BVCBO
Min.
-500
-500
-7
-
-
-
-
-
-
100
80
50
-
-
-
Typ.
Max.
Unit
Test Conditions
-
-
-
-
-
-
-
-
-
V
V
V
nA
nA
nA
V
V
V
-
-
IC=-100μA
IC=-1mA
IE=-50μA
VCB=-480V
BVCEO
BVEBO
ICBO
ICES
IEBO
*VCE(sat)
*VCE(sat)
*VBE(sat)
*hFE 1
*hFE 2
*hFE 3
fT
-100
-100
-100
-0.2
-0.2
-0.9
300
300
-
VCE=-480V, VBE=0V
VEB=-7V
-0.11
-0.11
-0.79
-
-
-
50
12
85
IC=-20mA, IB=-2mA
IC=-50mA, IB=-10mA
IC=-50mA, IB=-10mA
VCE=-10V, IC=-10mA
VCE=-10V, IC=-50mA
VCE=-10V, IC=-100mA
VCE=-10V, IC=-10mA, f=10MHz
VCB=-10V, IE=0A, f=1MHz
VEB=-0.5V, IC=0A, f=1MHz
-
-
-
-
MHz
pF
pF
Cob
Cib
*Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2%
Ordering Information
Device
Package
SOT-23
(Pb-free lead plating and halogen-free package)
Shipping
BTP9050N3-0-T1-G
3000 pcs / Tape & Reel
BTP9050N3
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
