Spec. No. : C213S3
Issued Date : 2003.04.25
Revised Date :
CYStech Electronics Corp.
Page No. : 3/3
SOT-323 Dimension
3
Marking:
A
Q
C
A1
Lp
detail Z
TE
1
2
T1
bp
e1
W
B
e
A
E
Z
D
3-Lead SOT-323 Pastic
Surface Mounted Package
CYStek Package Code: S3
θ
v
A
He
mm
2
0
1
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
scale
Inches
Min. Max.
Millimeters
Inches
Millimeters
DIM
DIM
Min.
0.80
0.00
0.30
0.10
1.80
1.15
1.3
Max.
1.10
0.10
0.40
0.25
2.20
1.35
-
Min.
0.0256
Max.
-
Min. Max.
A
A1
bp
C
0.0315 0.0433
0.0000 0.0039
0.0118 0.0157
0.0039 0.0098
0.0709 0.0866
0.0453 0.0531
e1
He
Lp
Q
0.65
2.00
0.15
0.13
0.2
-
2.25
0.45
0.23
-
0.0787 0.0886
0.0059 0.0177
0.0051 0.0091
D
v
0.0079
0.0079
-
-
-
E
w
0.2
10°
-
e
0.0512
-
-
θ
0°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTC5179S3
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
