Spec. No. : C306A3-S
Issued Date : 2005.09.29
Revised Date :
CYStech Electronics Corp.
Page No. : 4 / 5
TO-92 Taping Outline
H2AH2A
D2
H2
H2
A
H3
H4 H
L
L1
W1
H1
W
D1
D
F1F2
P
P1
T2
T
T1
P2
Millimeters
Max.
4.83
4.20
0.53
4.83
2.90
±0.3
16.50
9.50
1
DIM
Item
Min.
A
D
Component body height
Tape Feed Diameter
Lead Diameter
4.33
3.80
0.36
4.33
2.40
-
D1
D2
Component Body Diameter
Component Lead Pitch
F1-F2
F1,F2
F1,F2
H
Height Of Seating Plane
Feed Hole Location
15.50
8.50
-
H1
H2
H2A
H3
H4
L
Front To Rear Deflection
Deflection Left Or Right
Component Height
-
1
-
27
Feed Hole To Bottom Of Component
Lead Length After Component Removal
Lead Wire Enclosure
Feed Hole Pitch
-
21
-
11
L1
2.50
12.50
5.95
50.30
-
-
P
12.90
6.75
51.30
0.55
1.42
0.68
19.00
7.00
255
P1
P2
T
Center Of Seating Plane Location
4 Feed Hole Pitch
Over All Tape Thickness
Total Taped Package Thickness
Carrier Tape Thickness
Tape Width
T1
T2
W
-
0.36
17.50
5.00
253
W1
-
Adhesive Tape Width
20 pcs Pitch
BTA608A3
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
