Spec. No. : C248S3
Issued Date : 2012.07.09
Revised Date :
CYStech Electronics Corp.
Page No. : 6/6
SOT-323 Dimension
Marking:
3
A
Q
L4_
XXX
C
A1
Lp
1
2
detail Z
bp
e1
W
B
Diagram:
e
A
E
Z
D
θ
v
A
He
mm
2
0
1
scale
3-Lead SOT-323 Plastic
Surface Mounted Package.
CYStek Package Code: S3
• BAS70 S3 : Single Diode
(Marking Code K73) • BAS70AS3 : Common Anode. (Marking Code K76)
• BAS70CS3 : Common Cathode. (Marking Code K75) • BAS70SS3 : Series Connected. (Marking Code K74)
*: Typical
Inches
Min. Max.
Millimeters
Inches
Millimeters
Min. Max.
DIM
DIM
Min.
Max.
1.10
0.10
0.40
0.25
2.20
1.35
-
Min.
0.0256
Max.
-
A
A1
bp
C
D
E
0.0315 0.0433
0.0000 0.0039
0.0118 0.0157
0.0039 0.0098
0.0709 0.0866
0.0453 0.0531
0.80
0.00
0.30
0.10
1.80
1.15
1.3
e1
He
Lp
Q
v
w
0.65
2.00
0.15
0.13
0.2
-
2.25
0.45
0.23
-
0.0787 0.0886
0.0059 0.0177
0.0051 0.0091
0.0079
0.0079
-
-
-
-
0.2
-
e
0.0512
-
θ
10°
0°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: Pure tin plated.
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BAS70S3/BAS70AS3/BAS70CS3/BAS70SS3
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
