Spec. No. : C330LA
Issued Date : 2003.04.16
Revised Date :
CYStech Electronics Corp.
Page No. : 3/3
DO-201 Dimension
Marking : On the cylindrical surface
E
A
B
C
D
DO-201 Molded Plastic Package
CYStek Package Code: LA
*:Typical
Inches
DIM
Millimeters
DIM
Inches
Millimeters
Min.
Max.
Min.
1.20
Max.
1.30
-
Min.
Max.
-
Min.
25.40
4.80
Max.
-
A
B
C
0.0472 0.0512
D
E
1.0000
1.0000
-
25.40
7.20
0.1890 0.2087
5.30
0.2835 0.3740
9.50
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Lead : Axial leads, solderable per MIL-STD-202, Method 208 guaranteed.
• Mold Compound : Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
1N582XLA
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
