Data Sheet
BCM20730
Single-Chip Bluetooth Transceiver for Wireless
Input Devices
GENERAL DESCRIPTION
FEATURES
The Broadcom® BCM20730 is a Bluetooth 3.0-
compliant, stand-alone baseband processor with an
integrated 2.4 GHz transceiver. It is ideal for wireless
input device applications including game controllers,
keyboards, 3D glasses, remote controls, gestural
input devices, and sensor devices. Built-in firmware
adheres to the Bluetooth Human Interface Device
(HID) profile and Bluetooth Device ID profile
specifications.
• On-chip support for common keyboard and
mouse interfaces eliminates external processor
• Programmable keyscan matrix interface, up to
8 × 20 key-scanning matrix
• 3-axis quadrature signal decoder
• Shutter control for 3D glasses
• Infrared modulator
• IR learning
• Triac control
• Triggered Broadcom Fast Connect
• Supports Adaptive Frequency Hopping
• Excellent receiver sensitivity
• Bluetooth specification 3.0 compatible, including
enhanced power control (Unicast Connectionless
Data)
The BCM20730 radio has been designed to provide
low power, low cost, and robust communications for
applications operating in the globally available
2.4 GHz unlicensed ISM band. It is fully compliant
with Bluetooth Radio Specification 3.0.
• Bluetooth HID profile version 1.0 compliant
• Bluetooth Device ID profile version 1.3 compliant
The single-chip Bluetooth transceiver is a monolithic
component implemented in a standard digital CMOS
process and requires minimal external components
to make a fully compliant Bluetooth device. The
BCM20730 is available in three package options: a
32-pin, 5 mm × 5 mm QFN, a 40-pin, 6 mm × 6 mm
QFN, and a 64-pin, 7 mm × 7 mm BGA.
• Bluetooth AVRCP-CT profile version 1.3
compliant
• 10-bit auxiliary ADC with 28 analog channels
• On-chip support for serial peripheral interface
(master and slave modes)
• Broadcom Serial Communications (BSC) interface
APPLICATIONS
2
(compatible with Philips® (now NXP) I C slaves)
• Wireless pointing devices: mice, trackballs,
gestural controls
• Programmable output power control meets
Class 2 or Class 3 requirements
• Wireless keyboards
• 3D glasses
• Remote controls
• Game controllers
• Point-of-sale (POS) input devices
• Remote sensors
• Class 1 operation supported with external PA and
T/R switch
• Integrated ARM Cortex™-M3 based
microprocessor core
• On-chip power-on reset (POR)
• Support for EEPROM and serial flash interfaces
• Integrated low-dropout regulator (LDO)
• Home automation
• Personal health and fitness monitoring
• On-chip software controlled power management
unit
• Three package types are available:
– 32-pin QFN package (5 mm × 5 mm)
– 40-pin QFN package (6 mm × 6 mm)
– 64-pin BGA package (7 mm × 7 mm)
• RoHS compliant
20730-DS108-R
5300 California Avenue • Irvine, CA 92617 • Phone: 949-926-5000 • Fax: 949-926-5203
September 9, 2013
CYPRESS [ CYPRESS ]
