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C460EZ290-0208-2 参数 Datasheet PDF下载

C460EZ290-0208-2图片预览
型号: C460EZ290-0208-2
PDF下载: 下载PDF文件 查看货源
内容描述: 的EZBright LED RF性能朗伯辐射 [EZBright LED RF Performance Lambertian Radiation]
分类和应用:
文件页数/大小: 5 页 / 411 K
品牌: CREE [ CREE, INC ]
 浏览型号C460EZ290-0208-2的Datasheet PDF文件第1页浏览型号C460EZ290-0208-2的Datasheet PDF文件第3页浏览型号C460EZ290-0208-2的Datasheet PDF文件第4页浏览型号C460EZ290-0208-2的Datasheet PDF文件第5页  
Maximum Ratings at TA = 25°CNotes 1&3  
DCꢀForwardꢀCurrent  
CxxxEZ290-Sxx00-2  
50ꢀmA  
PeakꢀForwardꢀCurrentꢀ(1/10ꢀdutyꢀcycleꢀ@ꢀ1ꢀkHz)  
LEDꢀJunctionꢀTemperature  
100ꢀmA  
125°C  
ReverseꢀVoltage  
5ꢀV  
OperatingꢀTemperatureꢀRange  
-40°Cꢀtoꢀ+100°C  
-40°Cꢀtoꢀ+100°C  
1000ꢀV  
StorageꢀTemperatureꢀRange  
ElectrostaticꢀDischargeꢀThresholdꢀ(HBM)ꢀNoteꢀ2  
ElectrostaticꢀDischargeꢀClassificationꢀ(MIL-STD-883E)ꢀNoteꢀ2  
Classꢀ2  
Note 3  
Typical Electrical/Optical Characteristics at TA = 25°C, If = 20 mA  
Reverse Current  
[I(Vr=5V), μA]  
Full Width Half Max  
Part Number  
Forward Voltage (Vf, V)  
(λD, nm)  
Min.  
Typ.  
3.1  
Max.  
Max.  
Typ.  
21  
C460EZ290-Sxx00-2  
C470EZ290-Sxx00-2  
C527EZ290-Sxx00-2  
2.7  
2.7  
2.9  
3.7  
3.7  
3.9  
2
2
2
3.1  
22  
3.2  
35  
Mechanical Specifications  
Description  
CxxxEZ290-Sxx00-2  
Dimension  
Tolerance  
±ꢀ25  
P-NꢀJunctionꢀAreaꢀ(μm)  
TopꢀAreaꢀ(μm)  
226ꢀxꢀ226  
280ꢀxꢀ280  
280ꢀxꢀ280  
170  
±ꢀ25  
BottomꢀAreaꢀ(μm)  
±ꢀ25  
ChipꢀThicknessꢀ(μm)  
±ꢀ25  
AuꢀBondꢀPadꢀDiameterꢀ(μm)  
AuꢀBondꢀPadꢀThicknessꢀ(μm)  
BackꢀContactꢀMetalꢀAreaꢀ(μm)  
BackꢀContactꢀMetalꢀThicknessꢀ(μm)ꢀNoteꢀ4  
100  
-15,ꢀ+5  
±ꢀ1.0  
±ꢀ25  
3.0  
280ꢀxꢀ280  
3.0  
±ꢀ0.3  
Notes:  
1.ꢀ Maximumꢀ ratingsꢀ areꢀ packageꢀ dependent.ꢀ Theꢀ aboveꢀ ratingsꢀ wereꢀ determinedꢀ usingꢀ aꢀ T-1ꢀ 3/4ꢀ packageꢀ (withꢀ Hysolꢀ OS4000ꢀ  
epoxy)ꢀforꢀcharacterization.ꢀRatingsꢀforꢀotherꢀpackagesꢀmayꢀdiffer.ꢀTheꢀforwardꢀcurrentsꢀ(DCꢀandꢀPeak)ꢀareꢀnotꢀlimitedꢀbyꢀtheꢀdieꢀ  
butꢀbyꢀtheꢀeffectꢀofꢀtheꢀLEDꢀjunctionꢀtemperatureꢀonꢀtheꢀpackage.ꢀTheꢀjunctionꢀtemperatureꢀlimitꢀofꢀ125°CꢀisꢀaꢀlimitꢀofꢀtheꢀT-1ꢀ  
3/4ꢀpackage;ꢀjunctionꢀtemperatureꢀshouldꢀbeꢀcharacterizedꢀinꢀaꢀspecificꢀpackageꢀtoꢀdetermineꢀlimitations.ꢀAssemblyꢀprocessingꢀ  
temperatureꢀmustꢀnotꢀexceedꢀ325°Cꢀ(<5ꢀseconds).ꢀꢀSeeꢀCreeꢀEZBrightꢀApplicationsꢀNoteꢀforꢀassemblyꢀprocessꢀinformation.  
2.ꢀ Productꢀresistanceꢀtoꢀelectrostaticꢀdischargeꢀ(ESD)ꢀaccordingꢀtoꢀtheꢀHBMꢀisꢀmeasuredꢀbyꢀsimulatingꢀESDꢀusingꢀaꢀrapidꢀavalancheꢀ  
energyꢀtestꢀ(RAET).ꢀTheꢀRAETꢀproceduresꢀareꢀdesignedꢀtoꢀapproximateꢀtheꢀmaximumꢀESDꢀratingsꢀshown.ꢀTheꢀRAETꢀprocedureꢀisꢀ  
performedꢀonꢀeachꢀdie.ꢀTheꢀESDꢀclassificationꢀofꢀClassꢀ2ꢀisꢀbasedꢀonꢀsampleꢀtestingꢀaccordingꢀtoꢀMIL-STD-883E.  
3.ꢀ Allꢀproductsꢀconformꢀtoꢀtheꢀlistedꢀminimumꢀandꢀmaximumꢀspecificationsꢀforꢀelectricalꢀandꢀopticalꢀcharacteristicsꢀwhenꢀassembledꢀ  
andꢀoperatedꢀatꢀ20ꢀmAꢀwithinꢀtheꢀmaximumꢀratingsꢀshownꢀabove.ꢀEfficiencyꢀdecreasesꢀatꢀhigherꢀcurrents.ꢀTypicalꢀvaluesꢀgivenꢀ  
arewithintherangeofaveragevaluesexpectedbymanufacturerinlargequantitiesandareprovidedforinformationonly.Allꢀ  
measurementsꢀwereꢀmadeꢀusingꢀlampsꢀinꢀT-1ꢀ3/4ꢀpackagesꢀ(withꢀHysolꢀOS4000ꢀepoxy).ꢀOpticalꢀcharacteristicsꢀmeasuredꢀinꢀanꢀ  
integratingꢀsphereꢀusingꢀIlluminanceꢀE.  
4.ꢀ Specificationsꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.  
Cree,ꢀInc.  
Copyrightꢀ©ꢀ2010ꢀCree,ꢀInc.ꢀAllꢀrightsꢀreserved.ꢀTheꢀinformationꢀinꢀthisꢀdocumentꢀisꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.ꢀCree,ꢀtheꢀCreeꢀ  
4600ꢀSiliconꢀDrive  
logoꢀandꢀEZBrightꢀareꢀregisteredꢀtrademarks,ꢀandꢀEZ,ꢀEZ290,ꢀEZ-08,ꢀEZ-18ꢀandꢀEZ-21ꢀareꢀtrademarksꢀofꢀCree,ꢀInc.ꢀ  
Durham,ꢀNCꢀ27703  
USAꢀTel:ꢀ+1.919.313.5300  
www.cree.com  
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