Maximum Ratings at TA = 25°CNotes 1 & 3
DCꢀForwardꢀCurrent
CxxxEZ1950-Sxxxx00-x
3000ꢀmA
PeakꢀForwardꢀCurrentꢀ(1/10ꢀdutyꢀcycleꢀ@ꢀ1ꢀkHz)
LEDꢀJunctionꢀTemperature
ꢀꢀꢀꢀꢀꢀꢀ4000ꢀmAꢀNoteꢀ4
150°C
ReverseꢀVoltage
5ꢀV
OperatingꢀTemperatureꢀRange
LEDꢀChipꢀStorageꢀTemperature
RecommendedꢀDieꢀSheetꢀStorageꢀConditions
-40°Cꢀtoꢀ+100°C
-40°Cꢀtoꢀ+120°C
≤30°Cꢀ/ꢀ≤85%ꢀRH
Note 2
Typical Electrical/Optical Characteristics at TA = 25°C, If = 700 mA
Reverse Current
[I(Vr=5V), μA]
Full Width Half Max
Part Number
Forward Voltage (Vf, V)
(λD, nm)
Min.
Typ.
3.2
Max.
Max.
Typ.
20
C450EZ1950-Sxxxx00-x
C460EZ1950-Sxxxx00-x
2.9
2.9
3.6
3.6
2
2
3.2
21
Mechanical Specifications
Description
CxxxEZ1950-Sxxxx00-x
Dimensions
Tolerance
±ꢀ35
P-NꢀJunctionꢀAreaꢀ(μm)
ChipꢀAreaꢀ(μm)
1900ꢀxꢀ1900
1930ꢀxꢀ1930
220
±ꢀ35
ChipꢀThicknessꢀ(μm)
±ꢀ25
TopꢀAuꢀBondꢀPadꢀ(μm)ꢀ-ꢀQty.ꢀ2
AuꢀBondꢀPadꢀThicknessꢀ(μm)
BacksideꢀOhmicꢀMetalꢀAreaꢀ(μm)
BacksideꢀOhmicꢀMetalꢀThicknessꢀ(μm)
130ꢀxꢀ130
3.0
±ꢀ25
±ꢀ1.5
±ꢀ35
1930ꢀxꢀ1930
3.3
±ꢀ1.5
Notes:
1.
Maximumꢀratingsꢀareꢀpackage-dependent.ꢀTheꢀaboveꢀratingsꢀwereꢀdeterminedꢀusingꢀaꢀsiliconeꢀencapsulatedꢀchipꢀonꢀMCPCBꢀforꢀ
characterization.ꢀRatingsꢀforꢀotherꢀpackagesꢀmayꢀdiffer.ꢀTheꢀjunctionꢀtemperatureꢀshouldꢀbeꢀcharacterizedꢀinꢀaꢀspecificꢀpackageꢀtoꢀ
determineꢀlimitations.ꢀAssemblyꢀprocessingꢀtemperatureꢀmustꢀnotꢀexceedꢀ325°Cꢀ(<ꢀ5ꢀseconds).ꢀꢀSeeꢀCreeꢀEZBrightꢀApplicationsꢀ
Noteꢀforꢀassembly-processꢀinformation.ꢀ
2.
Allꢀproductsꢀconformꢀtoꢀtheꢀlistedꢀminimumꢀandꢀmaximumꢀspecificationsꢀforꢀelectricalꢀandꢀopticalꢀcharacteristicsꢀwhenꢀassembledꢀ
andꢀoperatedꢀatꢀ700ꢀmAꢀwithinꢀtheꢀmaximumꢀratingsꢀshownꢀabove.ꢀEfficiencyꢀdecreasesꢀatꢀhigherꢀcurrents.ꢀTypicalꢀvaluesꢀgivenꢀ
areꢀwithinꢀtheꢀrangeꢀofꢀaverageꢀvaluesꢀexpectedꢀbyꢀtheꢀmanufacturerꢀinꢀlargeꢀquantitiesꢀandꢀareꢀprovidedꢀforꢀinformationꢀonly.ꢀAllꢀ
measurementsꢀwereꢀmadeꢀusingꢀaꢀAu-platedꢀTO39ꢀheaderꢀwithoutꢀanꢀencapsulant.ꢀOpticalꢀcharacteristicsꢀwereꢀmeasuredꢀinꢀanꢀ
integratingꢀsphereꢀusingꢀIlluminanceꢀE.
3500
3.
4.
Theꢀ maximumꢀ forwardꢀ currentꢀ isꢀ determinedꢀ
byꢀ theꢀ thermalꢀ resistanceꢀ betweenꢀ theꢀ LEDꢀ
junctionꢀ andꢀ ambient.ꢀ Itꢀ isꢀ crucialꢀ forꢀ theꢀ
end-productꢀ toꢀ beꢀ designedꢀ inꢀ aꢀ mannerꢀ thatꢀ
minimizesꢀtheꢀthermalꢀresistanceꢀfromꢀtheꢀLEDꢀ
junctionꢀtoꢀambientꢀinꢀorderꢀtoꢀoptimizeꢀproductꢀ
performance.
3000
2500
2000
Peakꢀ Forwardꢀ Currentꢀ isꢀ anꢀ estimateꢀ onlyꢀ andꢀ
underꢀevaluation.
1500
Rth j-a = 4 °C/W
Rth j-a = 7 °C/W
1000
Rth j-a = 10 °C/W
Rth j-a = 15 °C/W
500
0
0
25
50
75
100
125
150
AmbientTemperature (°C)
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703-8475
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778
www.cree.com/chips
© 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo,
and EZBright® are registered trademarks, and EZ™ and EZ1950-p™ are trademarks of Cree, Inc.
2
CPR3GT Rev - (201502)
CREE [ CREE, INC ]
