Maximum Ratings at TA = 25°CNotes 1&3
DCꢀForwardꢀCurrent
CxxxUT190-Sxxxx-30
30ꢀmA
PeakꢀForwardꢀCurrentꢀ(1/10ꢀdutyꢀcycleꢀ@ꢀ1ꢀkHz)
LEDꢀJunctionꢀTemperature
100ꢀmA
125°C
ReverseꢀVoltage
5ꢀV
OperatingꢀTemperatureꢀRange
-40°Cꢀtoꢀ+100°C
-40°Cꢀtoꢀ+120°C
≤30°Cꢀ/ꢀ≤85%ꢀRH
1000ꢀV
LEDꢀChipꢀStorageꢀTemperature
RecommendedꢀDieꢀSheetꢀStorageꢀConditions
ElectrostaticꢀDischargeꢀThresholdꢀ(HBM)ꢀNoteꢀ2
ElectrostaticꢀDischargeꢀClassificationꢀ(MIL-STD-883E)ꢀNoteꢀ2
Classꢀ2
Note 3
Typical Electrical/Optical Characteristics at TA = 25°C, If = 5 mA
Reverse Current
[I(Vr=5 V), μA]
Full Width Half Max
Part Number
Forward Voltage (Vf, V)
(λD, nm)
Min.
Typ.
2.9
2.9
2.9
3.0
Max.
Max.
Typ.
21
C450UT190-Sxxxx-30
C460UT190-Sxxxx-30
C470UT190-Sxxxx-30
C527UT190-Sxxxx-30
2.7
2.7
2.7
2.7
3.1
3.1
3.1
3.2
2
2
2
2
21
22
35
Mechanical Specifications
Description
CxxxUT190-Sxxxx-30
Dimension
Tolerance
±ꢀ25
P-NꢀJunctionꢀAreaꢀ(μm)
ChipꢀTopꢀAreaꢀ(μm)
160ꢀxꢀ160
190ꢀxꢀ190
105ꢀxꢀ105
85
±ꢀ25
ChipꢀBottomꢀAreaꢀ(μm)
ChipꢀThicknessꢀ(μm)
±ꢀ25
±ꢀ10
AuꢀBondꢀPadꢀDiameterꢀ(μm)
AuꢀBondꢀPadꢀThicknessꢀ(μm)
BacksideꢀContactꢀMetalꢀAreaꢀ(μm)
70
-5,ꢀ+15
±ꢀ0.5
±ꢀ25
1.2
80ꢀxꢀ80
Notes:
1.ꢀ Maximumꢀ ratingsꢀ areꢀ packageꢀ dependent.ꢀ Theꢀ aboveꢀ ratingsꢀ wereꢀ determinedꢀ usingꢀ aꢀ T-1ꢀ 3/4ꢀ packageꢀ (withꢀ Hysolꢀ OS4000ꢀ
epoxy)ꢀforꢀcharacterization.ꢀRatingsꢀforꢀotherꢀpackagesꢀmayꢀdiffer.ꢀTheꢀforwardꢀcurrentsꢀ(DCꢀandꢀPeak)ꢀareꢀnotꢀlimitedꢀbyꢀtheꢀdieꢀ
butꢀbyꢀtheꢀeffectꢀofꢀtheꢀLEDꢀjunctionꢀtemperatureꢀonꢀtheꢀpackage.ꢀTheꢀjunctionꢀtemperatureꢀlimitꢀofꢀ125°CꢀisꢀaꢀlimitꢀofꢀtheꢀT-1ꢀ
3/4ꢀpackage;ꢀjunctionꢀtemperatureꢀshouldꢀbeꢀcharacterizedꢀinꢀaꢀspecificꢀpackageꢀtoꢀdetermineꢀlimitations.ꢀAssemblyꢀprocessingꢀ
temperatureꢀmustꢀnotꢀexceedꢀ325°Cꢀ(<ꢀ5ꢀseconds).
2.ꢀ Productꢀresistanceꢀtoꢀelectrostaticꢀdischargeꢀ(ESD)ꢀaccordingꢀtoꢀtheꢀHBMꢀisꢀmeasuredꢀbyꢀsimulatingꢀESDꢀusingꢀaꢀrapidꢀavalancheꢀ
energyꢀtestꢀ(RAET).ꢀTheꢀRAETꢀproceduresꢀareꢀdesignedꢀtoꢀapproximateꢀtheꢀminimumꢀESDꢀratingsꢀshown.ꢀTheꢀESDꢀclassificationꢀofꢀ
Classꢀ2ꢀisꢀbasedꢀonꢀsampleꢀtestingꢀaccordingꢀtoꢀMIL-STD-883E.ꢀ
3.ꢀ Allꢀproductsꢀconformꢀtoꢀtheꢀlistedꢀminimumꢀandꢀmaximumꢀspecificationsꢀforꢀelectricalꢀandꢀopticalꢀcharacteristicsꢀwhenꢀassembledꢀ
andꢀoperatedꢀatꢀ5ꢀmAꢀwithinꢀtheꢀmaximumꢀratingsꢀshownꢀabove.ꢀEfficiencyꢀdecreasesꢀatꢀhigherꢀcurrents.ꢀTypicalꢀvaluesꢀgivenꢀ
areꢀwithinꢀtheꢀrangeꢀofꢀaverageꢀvaluesꢀexpectedꢀbyꢀmanufacturerꢀinꢀlargeꢀquantitiesꢀandꢀareꢀprovidedꢀforꢀinformationꢀonly.ꢀAllꢀ
measurementsꢀwereꢀmadeꢀusingꢀlampsꢀinꢀT-1ꢀ3/4ꢀpackagesꢀ(withꢀHysolꢀOS4000ꢀepoxy).ꢀOpticalꢀcharacteristicsꢀmeasuredꢀinꢀanꢀ
integratingꢀsphereꢀusingꢀIlluminanceꢀE.
4.ꢀ Caution:ꢀ Toꢀ obtainꢀ optimumꢀ outputꢀ efficiency,ꢀ theꢀ amountꢀ ofꢀ epoxyꢀ usedꢀ shouldꢀ beꢀ characterizedꢀ basedꢀ uponꢀ theꢀ specificꢀ
application.ꢀ
Cree, Inc.
4600 Silicon Drive
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree,
the Cree logo and G•SiC are registered trademarks, and UltraThin and UT are trademarks of Cree, Inc.
Durham, NC 27703-8475 USA
Tel: +1-919-313-5300
Fax: +1-919-313-5870
www.cree.com/chips
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