Maximum Ratings at TA = 25°CNotes 1, 3 & 4
DCꢀForwardꢀCurrent
CxxxTR5270-Sxx00 and CxxxTR5270-Sxx00-3
250ꢀmA
300ꢀmA
PeakꢀForwardꢀCurrentꢀ(1/10ꢀdutyꢀcycleꢀ@ꢀ1ꢀkHz)
LEDꢀJunctionꢀTemperature
150°C
ReverseꢀVoltage
5ꢀV
OperatingꢀTemperatureꢀRange
-40°Cꢀtoꢀ+100°C
-40°Cꢀtoꢀ+120°C
≤30°Cꢀ/ꢀ≤85%ꢀRH
1000ꢀV
LEDꢀChipꢀStorageꢀTemperature
RecommendedꢀDieꢀSheetꢀStorageꢀConditions
ElectrostaticꢀDischargeꢀThresholdꢀ(HBM)ꢀNoteꢀ2
ElectrostaticꢀDischargeꢀClassificationꢀ(MIL-STD-883E)ꢀNoteꢀ2
Classꢀ2
Note 3
Typical Electrical/Optical Characteristics at TA = 25°C, If = 120 mA
Reverse Current
[I(Vr=5V), μA]
Full Width Half Max
Part Number
Forward Voltage (Vf, V)
(λD, nm)
Min.
Typ.
3.2ꢀ
3.2ꢀ
3.2ꢀ
3.2ꢀ
Max.
Max.
2ꢀ
Typ.
20ꢀ
21ꢀ
20ꢀ
21ꢀ
C450TR5270-Sxx000
C460TR5270-Sxx000ꢀ
C450TR5270-Sxx000-3ꢀ
C460TR5270-Sxx000-3ꢀ
2.7ꢀ
2.7ꢀ
2.7ꢀ
2.7ꢀ
3.5ꢀ
3.5ꢀ
3.5ꢀ
3.5ꢀ
2ꢀ
2ꢀ
2ꢀ
Notes:
1.ꢀ Maximumꢀ ratingsꢀ areꢀ package-dependent.ꢀ Theꢀ aboveꢀ ratingsꢀ wereꢀ determinedꢀ usingꢀ lampsꢀ inꢀ chip-on-MCPCBꢀ (metalꢀ coreꢀ PCB)ꢀ packagesꢀ forꢀ
characterization.ꢀRatingsꢀforꢀotherꢀpackagesꢀmayꢀdiffer.ꢀJunctionꢀtemperatureꢀshouldꢀbeꢀcharacterizedꢀinꢀaꢀspecificꢀpackageꢀtoꢀdetermineꢀlimitations.ꢀ
Assemblyꢀprocessingꢀtemperatureꢀmustꢀnotꢀexceedꢀ325°Cꢀ(<ꢀ5ꢀseconds).
2.ꢀ Productꢀresistanceꢀtoꢀelectrostaticꢀdischargeꢀ(ESD)ꢀaccordingꢀtoꢀtheꢀHBMꢀisꢀmeasuredꢀbyꢀsimulatingꢀESDꢀusingꢀaꢀrapidꢀavalancheꢀenergyꢀtestꢀ(RAET).ꢀ
TheꢀRAETꢀproceduresꢀareꢀdesignedꢀtoꢀapproximateꢀtheꢀmaximumꢀESDꢀratingsꢀshown.
3.ꢀ Allꢀproductsꢀconformꢀtoꢀtheꢀlistedꢀminimumꢀandꢀmaximumꢀspecificationsꢀforꢀelectricalꢀandꢀopticalꢀcharacteristicsꢀwhenꢀassembledꢀandꢀoperatedꢀatꢀ120ꢀ
mAꢀwithinꢀtheꢀmaximumꢀratingsꢀshownꢀabove.ꢀEfficiencyꢀdecreasesꢀatꢀhigherꢀcurrents.ꢀTypicalꢀvaluesꢀgivenꢀareꢀwithinꢀtheꢀrangeꢀofꢀaverageꢀvaluesꢀ
expectedꢀbyꢀmanufacturerꢀinꢀlargeꢀquantitiesꢀandꢀareꢀprovidedꢀforꢀinformationꢀonly.ꢀAllꢀmeasurementsꢀwereꢀmadeꢀusingꢀlampsꢀinꢀT-1ꢀ3/4ꢀpackagesꢀ
(withꢀHysolꢀOS4000ꢀepoxyꢀencapsulantꢀandꢀclearꢀepoxyꢀdieꢀattach).ꢀOpticalꢀcharacteristicsꢀmeasuredꢀinꢀanꢀintegratingꢀsphereꢀusingꢀIlluminanceꢀE.
4.ꢀ TheꢀmaximumꢀforwardꢀcurrentꢀisꢀdeterminedꢀbyꢀtheꢀthermalꢀresistanceꢀbetweenꢀtheꢀLEDꢀjunctionꢀandꢀambient.ꢀItꢀisꢀcrucialꢀforꢀtheꢀend-productꢀtoꢀbeꢀ
designedꢀinꢀaꢀmannerꢀthatꢀminimizesꢀtheꢀthermalꢀresistanceꢀfromꢀtheꢀLEDꢀjunctionꢀtoꢀambientꢀinꢀorderꢀtoꢀoptimizeꢀproductꢀperformance.
300
250
200
150
Rth j-a = 10 C/W
Rth j-a = 20 C/W
Rth j-a = 30 C/W
Rth j-a = 40 C/W
100
50
0
50
75
100
125
150
175
Ambient Temperature (C)
Cree, Inc.
4600 Silicon Drive
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
and the Cree logo are registered trademarks, and TR and TR5270 are trademarks of Cree, Inc.
Durham, NC 27703-8475 USA
Tel: +1-919-313-5300
Fax: +1-919-313-5870
www.cree.com/chips
3
CPR3ET Rev. A
CREE [ CREE, INC ]
