Maximum Ratings at TA = 25°CNotes 1&3
DCꢀForwardꢀCurrent
CxxxTR2436-Sxx00
30ꢀmA
PeakꢀForwardꢀCurrentꢀ(1/10ꢀdutyꢀcycleꢀ@ꢀ1ꢀkHz)
LEDꢀJunctionꢀTemperature
100ꢀmA
125°C
ReverseꢀVoltage
5ꢀV
OperatingꢀTemperatureꢀRange
-40°Cꢀtoꢀ+100°C
-40°Cꢀtoꢀ+120°C
≤30°Cꢀ/ꢀ≤85%ꢀRH
1000ꢀV
LEDꢀChipꢀStorageꢀTemperature
DieꢀSheetꢀStorageꢀConditions
ElectrostaticꢀDischargeꢀThresholdꢀ(HBM)ꢀNoteꢀ2
ElectrostaticꢀDischargeꢀClassificationꢀ(MIL-STD-883E)ꢀNoteꢀ2
Classꢀ2
Note 3
Typical Electrical/Optical Characteristics at TA = 25°C, If = 20 mA
Reverse Current
[I(Vr=5V), μA]
Full Width Half Max
Part Number
Forward Voltage (Vf, V)
(λD, nm)
Min.
Typ.
3.1
3.1
3.1
3.2
Max.
Max.
Typ.
20
C450TR2436-Sxx00
C460TR2436-Sxx00
C470TR2436-Sxx00
C527TR2436-Sxx00
2.7
2.7
2.7
2.9
3.4
3.4
3.4
3.6
2
2
2
2
21
21
35
Mechanical Specifications
Description
CxxxTR2436-Sxx00
Dimension
Tolerance
±35
P-NꢀJunctionꢀAreaꢀ(μm)
ChipꢀAreaꢀ(μm)
200ꢀxꢀ320
240ꢀxꢀ360
115
±35
ChipꢀThicknessꢀ(μm)
±15
AuꢀBondꢀPadꢀDiameterꢀAnodeꢀ(μm)
AuꢀBondꢀPadꢀThicknessesꢀ(μm)
AuꢀBondꢀPadꢀAreaꢀCathodeꢀ(μm)
BottomꢀAreaꢀꢀ(μm)
90
-5,ꢀ+15
±0.5
1.0
98ꢀxꢀ98
140ꢀxꢀ260
-5,ꢀ+15
±35
Notes:
1.ꢀ Maximumꢀratingsꢀareꢀpackageꢀdependent.ꢀTheꢀaboveꢀratingsꢀwereꢀdeterminedꢀusingꢀaꢀT-1ꢀ3/4ꢀpackageꢀ(withꢀHysolꢀOS4000ꢀepoxyꢀ
encapsulationꢀandꢀclearꢀepoxyꢀdieꢀattach)ꢀforꢀcharacterization.ꢀRatingsꢀforꢀotherꢀpackagesꢀmayꢀdiffer.ꢀTheꢀforwardꢀcurrentsꢀ(DCꢀ
andꢀPeak)ꢀareꢀnotꢀlimitedꢀbyꢀtheꢀdieꢀbutꢀbyꢀtheꢀeffectꢀofꢀtheꢀLEDꢀjunctionꢀtemperatureꢀonꢀtheꢀpackage.ꢀTheꢀjunctionꢀtemperatureꢀ
limitꢀofꢀ125°CꢀisꢀaꢀlimitꢀofꢀtheꢀT-1ꢀ3/4ꢀpackage;ꢀjunctionꢀtemperatureꢀshouldꢀbeꢀcharacterizedꢀinꢀaꢀspecificꢀpackageꢀtoꢀdetermineꢀ
limitations.ꢀAssemblyꢀprocessingꢀtemperatureꢀmustꢀnotꢀexceedꢀ325°Cꢀ(<ꢀ5ꢀseconds).
2.ꢀ Productꢀresistanceꢀtoꢀelectrostaticꢀdischargeꢀ(ESD)ꢀaccordingꢀtoꢀtheꢀHBMꢀisꢀmeasuredꢀbyꢀsimulatingꢀESDꢀusingꢀaꢀrapidꢀavalancheꢀ
energyꢀtestꢀ(RAET).ꢀTheꢀRAETꢀproceduresꢀareꢀdesignedꢀtoꢀapproximateꢀtheꢀmaximumꢀESDꢀratingsꢀshown.
3.ꢀ Allꢀproductsꢀconformꢀtoꢀtheꢀlistedꢀminimumꢀandꢀmaximumꢀspecificationsꢀforꢀelectricalꢀandꢀopticalꢀcharacteristicsꢀwhenꢀassembledꢀ
andꢀoperatedꢀatꢀ20ꢀmAꢀwithinꢀtheꢀmaximumꢀratingsꢀshownꢀabove.ꢀEfficiencyꢀdecreasesꢀatꢀhigherꢀcurrents.ꢀTypicalꢀvaluesꢀgivenꢀ
areꢀwithinꢀtheꢀrangeꢀofꢀaverageꢀvaluesꢀexpectedꢀbyꢀmanufacturerꢀinꢀlargeꢀquantitiesꢀandꢀareꢀprovidedꢀforꢀinformationꢀonly.ꢀAllꢀ
measurementsꢀwereꢀmadeꢀusingꢀlampsꢀinꢀT-1ꢀ3/4ꢀpackagesꢀ(withꢀHysolꢀOS4000ꢀepoxyꢀencapsulantꢀandꢀclearꢀepoxyꢀdieꢀattach).ꢀ
OpticalꢀcharacteristicsꢀmeasuredꢀinꢀanꢀintegratingꢀsphereꢀusingꢀIlluminanceꢀE.
Cree, Inc.
4600 Silicon Drive
Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
and the Cree logo are registered trademarks, and TR and TR2436 are trademarks of Cree, Inc.
Durham, NC 27703-8475 USA
Tel: +1-919-313-5300
Fax: +1-919-313-5870
www.cree.com/chips
2
CPR3DR Rev B
CREE [ CREE, INC ]
