Maximum Ratings at TA = 25°CNote 1
DCꢀForwardꢀCurrent
CxxxEZ500-Sxxx00-2
300ꢀmA
PeakꢀForwardꢀCurrent
400ꢀmAꢀNoteꢀ3
150°C
LEDꢀJunctionꢀTemperature
ReverseꢀVoltage
5ꢀV
OperatingꢀTemperatureꢀRange
LEDꢀChipꢀStorageꢀTemperature
RecommendedꢀDieꢀSheetꢀStorageꢀConditions
-40°Cꢀtoꢀ+100°C
-40°Cꢀtoꢀ+120°C
≤30°Cꢀ/ꢀ≤85%ꢀRH
Note 2
Typical Electrical/Optical Characteristics at TA = 25°C, If = 150 mA
Reverse Current
[I(Vr=5 V), μA]
Full Width Half Max
Part Number
Forward Voltage (VF, V)
(λD, nm)
Min.
Typ.
3.2
3.2
3.2
3.3
Max.
Max.
Typ.
19
C450EZ500-Sxxx00-2
C460EZ500-Sxxx00-2
C470EZ500-Sxxx00-2
C527EZ500-Sxxx00-2
2.8
2.8
2.8
2.8
3.6
3.6
3.6
3.6
2
2
2
2
20
23
35
Mechanical Specifications
Description
CxxxEZ500-Sxxx00-2
Dimension
Tolerance
±40
P-NꢀJunctionꢀAreaꢀ(µm)
ChipꢀAreaꢀ(µm)
450ꢀxꢀ450
480ꢀxꢀ480
170
±40
ChipꢀThicknessꢀ(µm)
±25
TopꢀAuꢀBondꢀPadꢀDiameterꢀ(µm)
AuꢀBondꢀPadꢀThicknessꢀ(µm)
BackꢀContactꢀMetalꢀAreaꢀ(µm)
BackꢀContactꢀMetalꢀThicknessꢀ(µm)
130ꢀxꢀ130
3.0
±15
±1.0
±40
480ꢀxꢀ480
3.0
±1.0
Notes:
1.ꢀ Maximumꢀratingsꢀareꢀpackage-dependent.ꢀꢀTheꢀaboveꢀratingsꢀwereꢀdeterminedꢀusingꢀaꢀsiliconeꢀencapsulatedꢀchipꢀonꢀMCPCBꢀforꢀ
characterization.ꢀꢀRatingsꢀforꢀotherꢀpackagesꢀmayꢀdiffer.ꢀꢀTheꢀjunctionꢀtemperatureꢀshouldꢀbeꢀcharacterizedꢀinꢀaꢀspecificꢀpackageꢀtoꢀ
determineꢀlimitations.ꢀꢀAssemblyꢀprocessingꢀtemperatureꢀmustꢀnotꢀexceedꢀ325°Cꢀ(<ꢀ5ꢀseconds).ꢀꢀSeeꢀCreeꢀEZBrightꢀApplicationsꢀ
Noteꢀforꢀassembly-processꢀinformation.
2.ꢀ Allꢀ productsꢀ conformꢀ toꢀ theꢀ listedꢀ
350
minimumꢀ andꢀ maximumꢀ specificationsꢀ
forꢀ electricalꢀ andꢀ opticalꢀ characteristicsꢀ
whenꢀassembledꢀandꢀoperatedꢀatꢀ350ꢀmAꢀ
withinꢀtheꢀmaximumꢀratingsꢀshownꢀabove.ꢀ
Efficiencyꢀ decreasesꢀ atꢀ higherꢀ currents.ꢀ
Typicalꢀvaluesꢀgivenꢀareꢀwithinꢀtheꢀrangeꢀ
ofꢀaverageꢀexpectedꢀbyꢀtheꢀmanufacturerꢀ
inꢀ largeꢀ quantitiesꢀ andꢀ areꢀ providedꢀ forꢀ
informationꢀonly.ꢀAllꢀmeasurementsꢀwereꢀ
madeꢀusingꢀaꢀAu-platedꢀTOꢀheaderꢀwithoutꢀ
anꢀ encapsulant.ꢀ Opticalꢀ characteristicsꢀ
measuredꢀinꢀ anꢀintegratingꢀ sphereꢀusingꢀ
IlluminanceꢀE.
300
250
200
150
100
50
Rth j-a = 10 °C/W
Rth j-a = 20 °C/W
Rth j-a = 30 °C/W
Rth j-a = 40 °C/W
3.ꢀ Theꢀ maximumꢀ forwardꢀ currentꢀ isꢀ
determinedꢀ byꢀ theꢀ thermalꢀ resistanceꢀ
betweenꢀtheꢀLEDꢀjunctionꢀandꢀambient.ꢀꢀItꢀ
isꢀcrucialꢀforꢀtheꢀend-productꢀtoꢀbeꢀdesignedꢀ
inꢀ aꢀ mannerꢀ thatꢀ minimizesꢀ theꢀ thermalꢀ
resistanceꢀfromꢀtheꢀLEDꢀjunctionꢀtoꢀambientꢀ
inꢀorderꢀtoꢀoptimizeꢀproductꢀperformance.
0
50
60
70
80
90
100
110
120
130
140
150
AmbientTemperature (°C)
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703-8475
USA Tel: +1.919.313.5300
Fax: +1.919.313.5870
www.cree.com/chips
Copyright © 2013 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the
Cree logo are registered trademarks, and EZBright, EZ, and EZ500-n are trademarks of Cree, Inc.
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CPR3EB Rev. A
CREE [ CREE, INC ]
