Maximum Ratings at TA = 25°CNote 1, 2 & 3
DCꢀForwardꢀCurrent
CxxxEZ1000-Sxx000-2
1000ꢀmA
PeakꢀForwardꢀCurrentꢀ(1/10ꢀdutyꢀcycleꢀ@ꢀ1ꢀkHz)
LEDꢀJunctionꢀTemperature
1250ꢀmA
150°C
ReverseꢀVoltage
5ꢀV
OperatingꢀTemperatureꢀRange
LEDꢀChipꢀStorageꢀTemperature
RecommendedꢀDieꢀSheetꢀStorageꢀConditions
-40°Cꢀtoꢀ+100°C
-40°Cꢀtoꢀ+120°C
≤30°Cꢀ/ꢀ≤85%ꢀRH
Note 2
Typical Electrical/Optical Characteristics at TA = 25°C, If = 350 mA
Reverse Current
[I(Vr=5V), μA]
Full Width Half Max
Part Number
Forward Voltage (Vf, V)
(λD, nm)
Min.
Typ.
3.2
Max.
Max.
Typ.
20
C450EZ1000-Sxx000-2
C460EZ1000-Sxx000-2
C527EZ1000-Sxx000-2
2.9
2.9
3.0
3.8
3.8
4.0
2
2
2
3.2
21
3.4
35
Mechanical Specifications
Description
CxxxEZ1000-Sxx000-2
Dimensions
Tolerance
±ꢀ35
P-NꢀJunctionꢀAreaꢀ(μm)
ChipꢀAreaꢀ(μm)
950ꢀxꢀ950
980ꢀxꢀ980
170
±ꢀ35
ChipꢀThicknessꢀ(μm)
±ꢀ25
TopꢀAuꢀBondꢀPadꢀ(μm)ꢀ-ꢀQty.ꢀ2
AuꢀBondꢀPadꢀThicknessꢀ(μm)
BackꢀContactꢀMetalꢀAreaꢀ(μm)
BackꢀContactꢀMetalꢀThicknessꢀ(μm)
150ꢀxꢀ150
3.0
±ꢀ25
±ꢀ1.5
±ꢀ35
980ꢀxꢀ980
3.0
±ꢀ1.5
Notes:
1.
Maximumꢀratingsꢀareꢀpackage-dependent.ꢀTheꢀaboveꢀratingsꢀwereꢀdeterminedꢀusingꢀaꢀ3.45ꢀxꢀ3.45ꢀmmꢀSMTꢀpackageꢀwithoutꢀanꢀ
encapsulantꢀforꢀcharacterization.ꢀRatingsꢀforꢀotherꢀpackagesꢀmayꢀdiffer.ꢀTheꢀjunctionꢀtemperatureꢀshouldꢀbeꢀcharacterizedꢀinꢀaꢀ
specificꢀpackageꢀtoꢀdetermineꢀlimitations.ꢀAssemblyꢀprocessingꢀtemperatureꢀmustꢀnotꢀexceedꢀ325°Cꢀ(<ꢀ5ꢀseconds).ꢀꢀSeeꢀCreeꢀ
EZBrightꢀApplicationsꢀNoteꢀforꢀassembly-processꢀinformation.ꢀ
2.
Allꢀproductsꢀconformꢀtoꢀtheꢀlistedꢀminimumꢀandꢀmaximumꢀspecificationsꢀforꢀelectricalꢀandꢀopticalꢀcharacteristicsꢀwhenꢀassembledꢀ
andꢀoperatedꢀatꢀ350ꢀmAꢀwithinꢀtheꢀmaximumꢀratingsꢀshownꢀabove.ꢀEfficiencyꢀdecreasesꢀatꢀhigherꢀcurrents.ꢀTypicalꢀvaluesꢀgivenꢀ
areꢀwithinꢀtheꢀrangeꢀofꢀaverageꢀvaluesꢀexpectedꢀbyꢀtheꢀmanufacturerꢀinꢀlargeꢀquantitiesꢀandꢀareꢀprovidedꢀforꢀinformationꢀonly.ꢀAllꢀ
measurementsꢀwereꢀmadeꢀusingꢀaꢀAu-platedꢀTO39ꢀheaderꢀwithoutꢀanꢀencapsulant.ꢀOpticalꢀcharacteristicsꢀwereꢀmeasuredꢀinꢀanꢀ
integratingꢀsphereꢀusingꢀIlluminanceꢀE.
3.
TheꢀmaximumꢀforwardꢀcurrentꢀisꢀdeterminedꢀbyꢀtheꢀthermalꢀresistanceꢀbetweenꢀtheꢀLEDꢀjunctionꢀandꢀambient.ꢀItꢀisꢀcrucialꢀforꢀ
theꢀend-productꢀtoꢀbeꢀdesignedꢀinꢀaꢀmannerꢀthatꢀminimizesꢀtheꢀthermalꢀresistanceꢀfromꢀtheꢀLEDꢀjunctionꢀtoꢀambientꢀinꢀorderꢀtoꢀ
optimizeꢀproductꢀperformance.
1200
1000
800
600
Rth j-a = 10 °C/W
Rth j-a = 15 °C/W
400
Rth j-a = 20 °C/W
Rth j-a = 25 °C/W
200
0
25
50
75
100
125
150
175
Ambient Temperature (˚C)
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703-8475
USA Tel: +1.919.313.5300
Fax: +1.919.313.5870
www.cree.com/chips
Copyright © 2009-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
and the Cree logo are registered trademarks, and EZBright. EZ1000 and EZ are trademarks of Cree, Inc.
2
CPR3EC Rev. B
CREE [ CREE, INC ]
