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C450EZ1000-S38000-2_16 参数 Datasheet PDF下载

C450EZ1000-S38000-2_16图片预览
型号: C450EZ1000-S38000-2_16
PDF下载: 下载PDF文件 查看货源
内容描述: [Cree EZ1000 Gen 2 LEDs]
分类和应用:
文件页数/大小: 5 页 / 366 K
品牌: CREE [ CREE, INC ]
 浏览型号C450EZ1000-S38000-2_16的Datasheet PDF文件第1页浏览型号C450EZ1000-S38000-2_16的Datasheet PDF文件第3页浏览型号C450EZ1000-S38000-2_16的Datasheet PDF文件第4页浏览型号C450EZ1000-S38000-2_16的Datasheet PDF文件第5页  
Maximum Ratings at TA = 25°CNote 1, 2 & 3  
DCꢀForwardꢀCurrent  
CxxxEZ1000-Sxx000-2  
1000ꢀmA  
PeakꢀForwardꢀCurrentꢀ(1/10ꢀdutyꢀcycleꢀ@ꢀ1ꢀkHz)  
LEDꢀJunctionꢀTemperature  
1250ꢀmA  
150°C  
ReverseꢀVoltage  
5ꢀV  
OperatingꢀTemperatureꢀRange  
LEDꢀChipꢀStorageꢀTemperature  
RecommendedꢀDieꢀSheetꢀStorageꢀConditions  
-40°Cꢀtoꢀ+100°C  
-40°Cꢀtoꢀ+120°C  
≤30°Cꢀ/ꢀ≤85%ꢀRH  
Note 2  
Typical Electrical/Optical Characteristics at TA = 25°C, If = 350 mA  
Reverse Current  
[I(Vr=5V), μA]  
Full Width Half Max  
Part Number  
Forward Voltage (Vf, V)  
(λD, nm)  
Min.  
Typ.  
3.2  
Max.  
Max.  
Typ.  
20  
C450EZ1000-Sxx000-2  
C460EZ1000-Sxx000-2  
C527EZ1000-Sxx000-2  
2.9  
2.9  
3.0  
3.8  
3.8  
4.0  
2
2
2
3.2  
21  
3.4  
35  
Mechanical Specifications  
Description  
CxxxEZ1000-Sxx000-2  
Dimensions  
Tolerance  
±ꢀ35  
P-NꢀJunctionꢀAreaꢀ(μm)  
ChipꢀAreaꢀ(μm)  
950ꢀxꢀ950  
980ꢀxꢀ980  
170  
±ꢀ35  
ChipꢀThicknessꢀ(μm)  
±ꢀ25  
TopꢀAuꢀBondꢀPadꢀ(μm)ꢀ-ꢀQty.ꢀ2  
AuꢀBondꢀPadꢀThicknessꢀ(μm)  
BackꢀContactꢀMetalꢀAreaꢀ(μm)  
BackꢀContactꢀMetalꢀThicknessꢀ(μm)  
150ꢀxꢀ150  
3.0  
±ꢀ25  
±ꢀ1.5  
±ꢀ35  
980ꢀxꢀ980  
3.0  
±ꢀ1.5  
Notes:  
1.  
Maximumꢀratingsꢀareꢀpackage-dependent.ꢀTheꢀaboveꢀratingsꢀwereꢀdeterminedꢀusingꢀaꢀ3.45ꢀxꢀ3.45ꢀmmꢀSMTꢀpackageꢀwithoutꢀanꢀ  
encapsulantforcharacterization.Ratingsforotherpackagesmaydiffer.Thejunctiontemperatureshouldbecharacterizedinaꢀ  
specificpackagetodeterminelimitations.Assemblyprocessingtemperaturemustnotexceed325°C(<5seconds).SeeCreeꢀ  
EZBrightꢀApplicationsꢀNoteꢀforꢀassembly-processꢀinformation.ꢀ  
2.  
Allꢀproductsꢀconformꢀtoꢀtheꢀlistedꢀminimumꢀandꢀmaximumꢀspecificationsꢀforꢀelectricalꢀandꢀopticalꢀcharacteristicsꢀwhenꢀassembledꢀ  
andꢀoperatedꢀatꢀ350ꢀmAꢀwithinꢀtheꢀmaximumꢀratingsꢀshownꢀabove.ꢀEfficiencyꢀdecreasesꢀatꢀhigherꢀcurrents.ꢀTypicalꢀvaluesꢀgivenꢀ  
areꢀwithinꢀtheꢀrangeꢀofꢀaverageꢀvaluesꢀexpectedꢀbyꢀtheꢀmanufacturerꢀinꢀlargeꢀquantitiesꢀandꢀareꢀprovidedꢀforꢀinformationꢀonly.ꢀAllꢀ  
measurementsꢀwereꢀmadeꢀusingꢀaꢀAu-platedꢀTO39ꢀheaderꢀwithoutꢀanꢀencapsulant.ꢀOpticalꢀcharacteristicsꢀwereꢀmeasuredꢀinꢀanꢀ  
integratingꢀsphereꢀusingꢀIlluminanceꢀE.  
3.  
TheꢀmaximumꢀforwardꢀcurrentꢀisꢀdeterminedꢀbyꢀtheꢀthermalꢀresistanceꢀbetweenꢀtheꢀLEDꢀjunctionꢀandꢀambient.ꢀItꢀisꢀcrucialꢀforꢀ  
theꢀend-productꢀtoꢀbeꢀdesignedꢀinꢀaꢀmannerꢀthatꢀminimizesꢀtheꢀthermalꢀresistanceꢀfromꢀtheꢀLEDꢀjunctionꢀtoꢀambientꢀinꢀorderꢀtoꢀ  
optimizeꢀproductꢀperformance.  
1200  
1000  
800  
600  
Rth j-a = 10 °C/W  
Rth j-a = 15 °C/W  
400  
Rth j-a = 20 °C/W  
Rth j-a = 25 °C/W  
200  
0
25  
50  
75  
100  
125  
150  
175  
Ambient Temperature (˚C)  
Cree, Inc.  
4600 Silicon Drive  
Durham, NC 27703-8475  
USA Tel: +1.919.313.5300  
Fax: +1.919.313.5870  
www.cree.com/chips  
Copyright © 2009-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree  
and the Cree logo are registered trademarks, and EZBright. EZ1000 and EZ are trademarks of Cree, Inc.  
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CPR3EC Rev. B