IXD_604
1.7 Thermal Characteristics
Package
Parameter
Symbol
Rating
Units
D2 (8-Pin DFN)
35
125
85
PI (8-Pin DIP)
θ
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
°C/W
°C/W
JA
SI (8-Pin Power SOIC)
SIA (8-Pin SOIC)
SI (8-Pin Power SOIC)
120
10
θ
JC
2 IXD_604 Performance
2.1 Timing Diagrams
VIH
VIH
VIL
INx
INx
VIL
t
t
ondly
offdly
t
t
ondly
offdly
90%
10%
90%
10%
OUTx
OUTx
t
t
t
t
f
r
r
f
2.2 Characteristics Test Diagram
ENA
ENB
+
INA
OUTA
VCC
0.1μF 10μF
-
VCC
Tektronix
Current Probe
GND
INB
CLOAD
6302
VIN
OUTB
Tektronix
Current Probe
6302
CLOAD
R02
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