IXD_602
1.7 Thermal Characteristics
Package
Parameter
Symbol
Rating
Units
IXDD602D2 (8-Pin DFN)
IXD_602PI (8-Pin DIP)
35
125
85
θ
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
°C/W
°C/W
JA
IXD_602SI (8-Pin Power SOIC)
IXD_602SIA (8-Pin SOIC)
IXD_602SI (8-Pin Power SOIC)
120
10
θ
JC
2 IXD_602 Performance
2.1 Timing Diagrams
VIH
VIH
VIL
INx
INx
VIL
t
t
t
t
ondly
ondly
offdly
offdly
90%
90%
10%
OUTx
10%
OUTx
t
t
t
t
r
f
f
r
Non-Inverting Driver Waveforms
Inverting Driver Waveforms
2.2 Characteristics Test Diagram
+
VCC
VCC
INA
INB
OUTA
OUTB
0.1μF 10μF
-
Tektronix
Current Probe
CLOAD
GND
6302
VIN
Tektronix
Current Probe
6302
CLOAD
R02
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