IXD_609
1.7 Thermal Characteristics
Package
Parameter
Symbol
Rating
Units
D2 (8-Pin DFN)
35
36
125
85
120
46
3
CI (5-Pin TO-220)
PI (8-Pin DIP)
Thermal Resistance, Junction-to-Ambient
°C/W
°C/W
JA
SI (8-Pin Power SOIC)
SIA (8-Pin SOIC)
YI (5-Pin TO-263)
CI (5-Pin TO-220)
SI (8-Pin Power SOIC)
YI (5-Pin TO-263)
Thermal Resistance, Junction-to-Case
10
2
JC
2 IXD_609 Performance
2.1 Timing Diagrams
VIH
VIH
IN
IN
VIL
VIL
t
t
t
t
ondly
offdly
offdly
ondly
90%
90%
10%
OUT
10%
OUT
t
t
t
t
r
r
f
f
2.2 Characteristics Test Diagram
+
VCC
IN
OUT
VCC
0.1μF 10μF
VCC
-
Tektronix
Current Probe
EN
GND
VIN
CLOAD
6302
R02
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