MECHANICAL DIMENSIONS
10.160 0.381
(0.400 0.015)
PC Board Pattern
(Top View)
16 Pin SOIC (“P” Suffix)
1.270 TYP.
(0.050 TYP.)
1.270
(0.050)
1.981 TYP.
(0.078 TYP.)
2.108 MAX.
7.493 0.127
10.363 0.127
(0.408 0.005)
(0.083 MAX.)
(0.295 0.005)
9.728 0.051
(0.383 0.002)
1.016 TYP.
0.254 0.0127
(0.010 0.0005)
(0.040 TYP.)
1.193
(0.047)
0.406 TYP.
(0.016) TYP.
0.787
(0.031)
8.890 TYP.
(0.350 TYP.)
Tape and Reel Packaging for 16 Pin SOIC Package
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
16.30 MAX.
(0.642 MAX.)
1
16
10.70
(0.421)
Top Cover
Tape
12.00
(0.172)
Embossed Carrier
10.90
(0.430)
2.70
(0.106)
Embossment
User Direction of Feed
4.90
(0.193)
Dimensions
mm
(inches)
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions
at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and
disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support
or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make
changes to its products at any time without notice.
Specification: DS-ITC107P-R1.2
©Copyright 2003, Clare, Inc.
OptoMOS® is a registered trademark of Clare, Inc.
All rights reserved. Printed in USA.
2/24/03
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