CPC1943
Manufacturing Information
Soldering
Washing
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
RoHS
2002/95/EC
Pb
e3
MECHANICAL DIMENSIONS
6-Pin DIP Package
PC Board Pattern (Top View)
3.302 0.051
(0.130 0.002)
2.540 0.127
(0.100 0.005)
2.540 0.127
(0.100 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
7.620 0.254
(0.300 0.010)
9.144 0.508
(0.360 0.020)
6.350 0.127
(0.250 0.005)
7.620 0.127
(0.300 0.005)
0.457 0.076
(0.018 0.003)
0.254 TYP.
(0.010 TYP.)
9.652 0.381
(0.380 0.015)
7.239 TYP.
(0.285 TYP.)
6.350 0.127
(0.250 0.005)
5.080 0.127
(0.200 0.005)
4.064 TYP.
(0.160 TYP.)
Dimensions
mm
(inches)
2.159 0.102
(0.085 0.004)
6-Pin Surface Mount Package
Recommended PCB Land Pattern
9.525 0.254
(0.375 0.010)
2.54
(0.10)
0.254 0.0127
(0.010 0.0005)
2.540 0.127
(0.100 0.005)
0.65
(0.0256)
8.90
6.350 0.127
(0.250 0.005)
7.620 0.254
(0.300 0.010)
(0.350)
0.457 0.076
(0.018 0.003)
0.635 0.127
(0.025 0.005)
1.65
(0.065)
9.652 0.381
(0.380 0.015)
4.445 0.127
(0.175 0.005)
3.302 0.051
(0.130 0.002)
Dimensions
mm
(inches)
2.159 0.102
(0.085 0.004)
R05
4
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