CPC1822
Manufacturing Information
Moisture Sensitivity
Soldering Reflow Profile
Clare has characterized the moisture reflow sensitivity
of this package, and has determined that this
component must be handled in accordance with
IPC/JEDEC standard J-STD-033 moisture sensitivity
level (MSL), level 3 classification.
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
RoHS
2002/95/EC
Washing
Pb
e3
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
MECHANICAL DIMENSIONS
8-Pin SOIC Package
Recommended PCB Land Pattern
0.19 - 0.25
(0.008 - 0.010)
1.55
(0.061)
0.40 - 1.27
(0.016 - 0.050)
3.80 - 4.00
(0.15 - 0.16)
5.80 - 6.20
(0.23 - 0.24)
5.40
(0.213)
PIN 1
1.27 TYP
(0.05 TYP)
0.33 - 0.51
(0.013 - 0.020)
0.60
(0.024)
1.27
(0.050)
4.80 - 5.00
(0.19 - 0.20)
0.10 - 0.25
(0.004 - 0.010)
Dimensions
mm
(inches)
1.35 - 1.75
(0.053 - 0.069)
0.394 - 0.648
(0.016 - 0.026)
Tape and Reel Packaging for 8-Pin SOIC-N Surface Mount Package
330.2 DIA.
(13.00 DIA.)
B0 = 5.50 ± 0.10
(0.217 ± 0.004)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W = 12.00 ± 0.30
(0.472 ± 0.012)
Pin 1
B0 = 5.30 ± 0.10
(0.209 ± 0.004)
Top Cover
Tape
Embossed Carrier
P = 8.00 ± 0.10
(0.315 ± 0.004)
A0 = 6.50 ± 0.10
(0.256 ± 0.004)
Dimensions
mm
(inches)
User Direction of Feed
K0= 2.10 ± 0.10
(0.083 ± 0.004)
Embossment
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications
and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of
Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability,
fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1822-R02
©Copyright 2009, Clare, Inc.
All rights reserved. Printed in USA.
2/12/09
3
CLARE [ CLARE ]
