CPC1302
Manufacturing Information
Soldering
Washing
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
MECHANICAL DIMENSIONS
8-Pin DIP Through Hole (Standard)
PC Board Pattern
9.652 0.381
(0.380 0.015)
(Top View)
2.540 0.12ꢀ
(0.100 0.005)
8-0.800 DIA.
2.540 0.12ꢀ
(0.100 0.005)
ꢀ.620 0.254
(0.300 0.010)
(8-0.031 DIA.)
9.144 0.508
(0.360 0.020)
3.302
(0.130)
6.350 0.12ꢀ
(0.250 0.005)
6.350 0.12ꢀ
(0.250 0.005)
ꢀ.620 0.12ꢀ
(0.300 0.005)
ꢀ.239 TYP.
(0.285)
9.144 TYP.
(0.360)
0.45ꢀ 0.0ꢀ6
(0.018 0.003)
ꢀ.620 0.12ꢀ
(0.300 0.005)
8.0ꢀꢀ 0.12ꢀ
(0.318 0.005)
8-Pin Surface Mount (“S” Suffix)
9.652 0.381
(0.380 0.015)
PC Board Pattern
(Top View)
2.540 0.12ꢀ
(0.100 0.005)
2.540 0.12ꢀ
(0.100 0.005)
ꢀ.620 0.254
(0.300 0.010)
3.302
(0.130)
9.525 0.254
(0.3ꢀ5 0.010)
4.445 0.12ꢀ
(0.1ꢀ5 0.005)
6.350 0.12ꢀ
(0.250 0.005)
8.305 0.12ꢀ
(0.32ꢀ 0.005)
1.905 0.12ꢀ
0.635 TYP.
(0.025)
(0.0ꢀ5 0.005)
0.254 TYP.
(0.010)
0.45ꢀ 0.0ꢀ6
(0.018 0.003)
1.498 0.12ꢀ
(0.059 0.005)
8.0ꢀꢀ 0.12ꢀ
(0.318 0.005)
Dimensions:
mm
(inches)
R01
4
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