Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
D
PACKAGE THERMAL DATA
5 Lead
Thermal Data TO-220
7 Lead
16 Lead
D2PAK SOIC Wide
Lead Count
Metric
Max Min
10.50 10.10 .413 .398
English
RQJC
RQJA
typ
typ
2.1
50
2.1
10-50*
23
105
ûC/W
ûC/W
Max Min
16 Lead SO Wide
*Depending on thermal properties of substrate. RQJA = RQJC + RQCA
.
Surface Mount Wide Body (DW); 300 mil wide
5 Lead TO-220 (THA) Horizontal
4.83 (.190)
4.06 (.160)
10.54 (.415)
9.78 (.385)
1.40 (.055)
1.14 (.045)
3.96 (.156)
3.71 (.146)
2.87 (.113)
2.62 (.103)
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
14.99 (.590)
14.22 (.560)
6.55 (.258)
5.94 (.234)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.77 (.109)
6.83 (.269)
1.68
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
2.92 (.115)
2.29 (.090)
0.56 (.022)
(.066)
TYP
0.81(.032)
0.36 (.014)
6.60 (.260)
5.84 (.230)
1.70 (.067)
0.32 (.013)
0.23 (.009)
1.27 (.050)
0.40 (.016)
6.81(.268)
0.30 (.012)
0.10 (.004)
D
REF: JEDEC MS-013
5 Lead TO-220 (T) Straight
5 Lead TO-220 (TVA) Vertical
4.83 (.190)
4.06 (.160)
1.40 (.055)
1.14 (.045)
4.83 (.190)
10.54 (.415)
9.78 (.385)
4.06 (.160)
3.96 (.156)
3.71 (.146)
10.54 (.415)
9.78 (.385)
1.40 (.055)
1.14 (.045)
3.96 (.156)
3.71 (.146)
2.87 (.113)
2.62 (.103)
6.55 (.258)
5.94 (.234)
6.55 (.258)
5.94 (.234)
14.99 (.590)
14.22 (.560)
2.87 (.113)
2.62 (.103)
14.99 (.590)
14.22 (.560)
1.78 (.070)
14.22 (.560)
13.72 (.540)
2.92 (.115)
2.29 (.090)
8.64 (.340)
7.87 (.310)
4.34 (.171)
7.51 (.296)
1.02 (.040)
0.76 (.030)
0.56 (.022)
0.36 (.014)
1.68
(.066) typ
1.70 (.067)
0.56 (.022)
0.36 (.014)
1.83(.072)
1.57(.062)
1.02(.040)
0.63(.025)
6.80 (.268)
.94 (.037)
.69 (.027)
6.93(.273)
6.68(.263)
2.92 (.115)
2.29 (.090)
8
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
