Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
D
8 Lead
20 Lead
5 Lead
Lead Count
Metric
English
Thermal Data SOIC SOIC Wide TO-220
Max
5.00
13.00 12.60
Min
4.80
Max Min
RQJC
RQJA
typ
typ
45
9
3.3
50
ûC/W
ûC/W
8L SOIC
20L SOIC
.197
.512
.189
.496
165
55
Surface Mount Narrow Body (D); 150 mil wide
6.20 (.244)
5.80 (.228)
4.00 (.157)
3.80 (.150)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
1.75 (.069) MAX
1.57 (.062)
1.37 (.054)
0.25 (.010)
0.19 (.008)
1.27 (.050)
0.40 (.016)
0.25 (0.10)
0.10 (.004)
D
REF: JEDEC MS-012
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
0.32 (.013)
0.23 (.009)
1.27 (.050)
0.40 (.016)
0.30 (.012)
0.10 (.004)
D
REF: JEDEC MS-013
7
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
