Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
16 Lead SO Wide
Thermal Data
D
RQJC
typ
typ
23
ûC/W
ûC/W
Lead Count
Metric
Max Min
10.50 10.10
English
Max Min
.413 .398
RQJA
105
16 Lead SO Wide
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
0.32 (.013)
0.23 (.009)
1.27 (.050)
0.40 (.016)
0.30 (.012)
0.10 (.004)
D
REF:ÊJEDECÊMS-013
Flip-Chip
0
.525 ± .05
13X .165 ± .038
1.022
.279
1.022
1.020
MB
CA
S
CS
CR
.496
OUT
2.39
CS-464
ÊFlip-ChipÊ
0
0
IN+
IC
D
.356
.431
.382
Test
VCC
IN- Gnd
2.14
1.021
1.017
.0302 MAX
13X .095 ± .045
0
Note: All dimensions in millimeters.
Bump Locations, Bump Side Up
Ordering Information
Part Number
CS464
CS464YDW16
CS464YDWR16
Description
Flip-Chip
16 Lead SO Wide
Cherry Semiconductor Corporation reserves the right to
make changes to the specifications without notice. Please
contact Cherry Semiconductor Corporation for the latest
available information.
16 Lead SO Wide (tape & reel)
Rev. 3/1/99
© 1999 Cherry Semiconductor Corporation
4
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
